1.
A double solid resin junction reference electrode has been developed.
研究了一种双固体树脂接界的参比电极。
2.
resin-solvent-curing agent
树脂-溶剂-固化剂
3.
a white crystalline solid occurring in many resins.
一种白色晶状固体，见于许多树脂中。
4.
The Curing Process Analysis of Boron Modified Phenolic-Epoxy Resin System
硼酚醛-环氧树脂体系固化过程分析
5.
Cured Compound in Cyanate Ester/Epoxy Co-Curing System
氰酸酯/环氧树脂共混体系固化反应
6.
Curing Behaviors of MOCA/Epoxy Resin System
MOCA/环氧树脂体系的固化行为
7.
Study on kinetics of modified BMI resin matrix with low temperature curable
低温固化改性BMI树脂基体动力学研究
8.
Study on Thermosetting Acrylic Resin with High Solid and Low Viscosity
高固体分、低粘度热固性丙烯酸树脂的研究
9.
STUDIES ON THE CURING ACTION OF EPOXYRESIN/BPEA -2 LATENT CURING SYSTEM;
环氧树脂/BPEA-2潜伏性固化体系固化行为的研究
10.
An Experimental Study on the Influences of Resin Matrix and Curing Systems on Mechanical Properties of Resin Composite;
树脂基质和固化体系对复合树脂性能影响的实验研究
11.
A Study on Mechanism of the Co-Reaction of Epoxy and Cyanate and the Mechanical Properties of Epoxy/Glass Cloth/Hollow Glass-Bead Blend;
环氧树脂/氰酸酯树脂固化反应机理及环氧树脂/玻璃布/玻璃微珠体系力学性能研究
12.
Unsaturated polyester resin--Determination of solid content
GB/T7193.3-1987不饱和聚酯树脂固体含量测定方法
13.
Application of resin anchor fixation in construction of frame structure wall connecting bar
树脂锚固在框架结构墙体拉结筋施工中的应用
14.
Research on Low Viscosity Bisphenol F Epoxy Curing System;
低粘度双酚F环氧树脂固化体系的研究
15.
Synthesis, Curing and Application of Epoxy Resins Containing Phosphorus and Nitrogen;
含磷氮环氧树脂体系的合成、固化及应用研究
16.
Intercalation and Exfoliation Behavior of Clay in Thermoset Resin/Clay System;
粘土在热固性树脂/粘土体系中插层及剥离行为
17.
Study on Latent Curing Agent of Epoxy Resin Sheeting Molding Compounds;
环氧树脂片状模塑料潜伏性固化体系研究
18.
Study on the Synthesis of Pinene Resin Catalyzed by Solid Acid from β-Pinrne;
β-蒎烯固体酸催化合成蒎烯树脂的研究