1.
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
2.
This paper introduces a new technics of producing light colour phenolic paper copper-clad laminate and summarizes the main effects on the laminates colour.
本文介绍了一种生产浅色覆铜箔酚醛纸层压板的工艺，总结了影响层压板颜色的因素。
3.
metal core copper-clad laminate
金属芯覆铜箔层压板
4.
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
5.
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
6.
Test methods for copper-clad laminated sheets for printed circuits
GB/T4722-1992印制电路用覆铜箔层压板试验方法
7.
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板
8.
The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates;
覆铜箔层压板专用环氧树脂的合成与性能
9.
New Generation High Heat Resistance,High Modulus and Low CTE Copper Clad Laminates
新一代高耐热性、高模量、低CTE覆铜箔层压板材料
10.
" Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards"
GB/T12630-1990一般用途的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
11.
"epoxide cellulose paper core, glass cloth surfaces copper-clad laminates"
环氧玻璃布纸复合覆铜箔板
12.
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T16315-1996印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板
13.
Study on Application of Nitrogen-Containing phenolic resin in Halogen-free Copper Clad Laminate
含氮酚醛在无卤覆铜板中的应用研究
14.
Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology
HDI多层板覆铜箔板生产技术的应用与开发
15.
Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T12629-1990限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
16.
epoxide woven glass fabric copper-clad laminates
环氧玻璃布基覆铜箔板
17.
ployester woven glass fabric copper-clad laminates
聚酯玻璃布覆铜箔板
18.
UV Blocking copper-clad laminates
紫外线阻挡型覆铜箔板