1.
Fe Doping Activation and Defect in Semi-insulating InP;
半绝缘InP单晶的Fe掺杂激活及缺陷研究
2.
Status of InP/GaAsSb/InP Double Heterojunction Bipolar Transistors Technology
InP/GaAsSb/InP双异质结双极晶体管技术发展现状(Ⅰ)
3.
Research of GaAs/InP Wafer Bonding Technology;
GaAs/InP晶片键合技术的研究
4.
90nm T-gate Lattice Matched InAlAs/InGaAs/InP HEMTs
栅长90nm的晶格匹配InAlAs/InGaAs/InP HEMT
5.
Lattice Mismatch Effect on Photoluminescence from InAs_xP_(1-x)/InP Heterostructuer
晶格失配对InAs_xP_(1-x)/InP发光特性的影响
6.
Researches on Electrical and Mechanical Characteristics of Low Temperature InP/Si Wafer Bonding;
InP/Si低温晶片键合的电特性和力学特性的研究
7.
Theory Analysis and Experiment Research of Low Temperature Si/InP Wafer Bonding Technology;
Si/InP晶片低温键合技术的理论分析和实验研究
8.
The fabrication & properties of three-dimentional InP inverse opal
反欧泊结构InP三维光子晶体的制备及研究
9.
Thermal Stress Distribution of GaAs and InP Crystals in LEC Growth and of GaAs Crystal in LEFZ Growth;
LEC法生长GaAs、InP晶体及LEFZ法生长GaAs晶体中热应力分布
10.
Study on the Key Technologies of InP-Based High-Speed Monolithically Integrated Photonic Devices;
InP基高速单片光子集成器件关键工艺的研究
11.
Research of Near-Infrared Single Photon Detector Based on the InGaAs/InP APD
基于InGaAs/InP APD的近红外单光子探测器的研究
12.
Investigation of 10 Gb/s Monolithic TIA Based on InGaAs/InP SHBT Technology
基于InGaAs/InP SHBT技术的10Gb/s单片跨阻放大器研究
13.
GaAs based InP/InGaAs HBT for monolithic integrated optical receiver application
用于单片集成光接收机前端的GaAs基InP/InGaAs HBT
14.
MBE Growth of InP Based PHEMT Epitaxial Materials;
分子束外延生长InP基赝配高电子迁移率晶体管外延材料
15.
A physical-model of small-signal InP-based double heterojunction bipolar transistors and its parameter extraction technique
一种InP双异质结双极晶体管小信号物理模型及其提取方法
16.
Theory and Experiment Investigation on InP-Based HBT and the Monolithic Integrated Photoreceiver;
InP基HBT及单片集成光接收机前端的理论与实验研究
17.
Theoretical Research on InP-Based HBT and the Fabrication of Monolithic OEIC of Photoreceiver s Front End;
InP基HBT的理论研究以及光接收机前端单片集成器件的制备
18.
Parameter Extraction Methods for Modelling HBT and Researches on InP-Based Monolithic Integrated Device;
HBT模型参数提取方法及InP基单片集成器件的研究