1.
Study on the Process of W/Cu Composites with Low CTE and High TC Used for Electronic Packaging;
电子封装用低膨胀高导热钨铜复合材料的工艺研究
2.
Preparation and Properties of Epoxy Electronic Encapsulating Materials with High Thermal Conductivity and Low Thermal Expansion Coefficient;
高导热低膨胀环氧塑封料的制备及性能研究
3.
High viscosity, highly filled epoxy formulation which, in addition to having excellent electrical properties, has unusually high thermal conductivity with low thermal expansion.
高粘度，高填充环氧树脂，有着良好的电气性能，高导热，低热膨胀。
4.
Preparation and properties of Cu-ZrW_2O_8 composites with high thermal conductivity and low thermal expansion coefficient
高热导率低热膨胀系数Cu-ZrW_2O_8复合材料的制备与性能
5.
A Study of Tungsten-Copper Composites Materials with Low CTE and High TC Used for Electronic Packaging;
电子封装用高导热低膨胀率W/Cu复合材料的研究
6.
Synchronous integration of diamond substrate and SiCp/Al composites with high thermal conductivity and low coefficient of thermal expansion
高导热、低膨胀铝基复合材料及其与金刚石膜片的同步复合
7.
Formation and properties of low expansive and heat-resistant aluminum alloy with high silicon content
耐热低膨胀高硅铝合金的成形与性能
8.
In hot weather the rod expands; So the bottom of the rod is lower. The bottom of the vessel is also lower; but the mercury in it expands. So the top of the mercury is higher.
热天金属杆膨胀，摆的底部变低，容器的底部也降低，而容器的水银膨胀后顶部升高。
9.
The results are 1) thermal expansion, and 2) thermal conductivity.
结果导致：1）热膨胀，和（2）热导率。
10.
Study on Thermal Expansion and Thermal Conductivity of Ultra High Toughness Cementitious Composites
超高韧性水泥基复合材料热膨胀性能及导热性能的研究
11.
Universality of the Dynamic Process of Thermal Expansion and Its Appearance in High-Tc Superconductors;
热膨胀动态过程普遍性及其在高温超导体中的体现
12.
If a metal bar is heated,the greater the heat applied, the larger the expansion.
若金属棒被加热，热量越高，它就越膨胀。
13.
Such economic overheating resulted in a very high inflation rate of 21.7 per cent in l994.
这种过热导致1994年通货膨胀达到21．7％。
14.
Such economic overheating resulted in a very high inflation rate of 21. 7 per cent in l994.
这种过热导致1994年通货膨胀达到21. 7％。
15.
Comparison study of electronic expansion valve and thermal expansion valve for low-temperature devices
电子膨胀阀与热力膨胀阀在低温装置中的比较研究
16.
coefficient of linear thermal expansion
线性热(膨)胀系数
17.
Study on In Situ Synthesis of Polyaniline/Exfoliated Graphite Composites and Electric Property
原位聚合-热膨胀制备聚苯胺/膨胀石墨复合物及导电性能研究
18.
They have the lowest productivity, the highest inflation and the largest public debt.
生产率最低，通货膨胀率最高，公债最多。