1.
Electromigration in Sn3.0Ag0.5Cu flip chip solder joint
Sn3.0Ag0.5Cu倒装焊点中的电迁移
2.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
3.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
4.
Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint;
倒装焊焊点中金属元素迁移及组织演变
5.
Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability
倒装焊器件尺寸参数对低k层及焊点的影响
6.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
7.
COMPUTER AIDED QUALITY MANAGEMENT SYSTEM FOR ASSEMBLE AND WELDING OF BODYWORK
车身装焊计算机辅助质量管理系统
8.
Ceramic Cushion of Steel Pipe Weld Aided Device and Its Welding Procedure
钢管焊缝陶瓷垫补焊装置及焊接工艺
9.
original body assembly shop-welding shop
原总装车间-焊装车间
10.
electrode ,of base metal, coated or cored with flux, for soldering, brazing or welding
焊条,贱金属制,外涂或内心装有焊剂,用于软焊,硬焊或熔焊
11.
electrode ,of metal carbides, coated or cored with flux, for soldering, brazing or welding
焊条,硬质合金制,外涂或内心装有焊剂,用于软焊,硬焊或熔焊
12.
All position pipe welding device for remote welding
用于遥控焊接的管道全位置焊接装置
13.
Locator Optimization for Resistance-spot-welding Fixtures
电阻点焊焊装夹具定位点的优化设计
14.
synthetic apparatus for weld thermal cycle
焊接热循环模拟装置
15.
spot-welded bar
以点焊方法安装的铁枝
16.
shop-field erection of tank
工厂内油罐的焊接装置
17.
grooving appliance, gas-operated, of the welding appliance type
熔焊装置型气动开槽机
18.
Familiar Wave soldering process. Familiar with assembly and packing process.
熟悉波峰焊制程，熟悉组装和包装制程。