1.
Test Research on Chip Formation of Ultra-precision Turning
超精密车削切屑形成过程的试验研究
2.
Experiments of ultra-precision turning of SiC_p/Al composites
SiC_p/Al复合材料的超精密车削试验
3.
Single Crystal Diamond Tool Wear Mechanism during Ultra-precision Turning of SiC_p/2024Al Metal Matrix Composites
SiC_p/2024Al复合材料超精密车削刀具磨损机理研究
4.
Optimized Design of Cutting Path for Freeform Surface in Ultra-Precision Turning
自由曲面超精密车削加工路径优化设计
5.
Research on a Novel 2 DOF Fast Tool Servo Actuator for Ultra-precision Diamond Turning;
用于超精密车削的两自由度快速刀具伺服驱动装置的研究
6.
Single Crystal Diamond and Polycrystalline Diamond Tools′ Applicability to Ultra-precision Turning of SiC_p/Al Composites
SCD及PCD刀具超精密车削SiC_p/2024Al复合材料适应性对比研究
7.
This article is focused on the ultra-precision machine technology, and SPDT and ultra-precision grinding technologies.
因此，本文针对超精密加工设备，以及单点钻石车削与超精密轮磨技术分别介绍说明。
8.
Grinding Performance of Soft Abrasive Grinding Wheel Used in Ultra-precision Grinding Sapphire Substrate;
超精密磨削蓝宝石基片的软磨料砂轮磨削性能
9.
Design and Research of Micro-positioning Platform for Ultra-precision Turning;
超精密切削微进给平台的设计与研究
10.
Development of Soft Abrasive Wheel Used in Ultra-precision Grinding Silicon Wafer
超精密磨削硅片的软磨料砂轮的研制
11.
Permeability of Cutting Fluid in Minimum Quantity Lubrication Precision Turning
最小量润滑精密车削中切削液的渗透性
12.
Precision round hole and cylindrical grinding: ultra-long and ultra-thin axis grinding, with precision to2μ， coaxial jumping within2μ.
★ 精密内、园磨削：超长、细轴磨削，尺寸精度达到2μ，同轴跳动2μ以内.
13.
Precision cylindrical grinding: ultra-long and ultra-thin axis grinding, with precision to2μ， coaxial jumping within2μ.
★ 精密外园磨削：超长、细轴磨削，尺寸精度达到2μ，同轴跳动2μ以内.
14.
The results show that vibration parameters have a great effect on the surface roughness and the tool life.
在精密车床上进行了金刚石刀具超声振动切削不锈钢零件的加工实验。
15.
Improvement Measures of Precision Turning of Slender Shafts on lathe
在普通车床上精密车削细长轴的改进措施
16.
Experimental Research on ELID Ultra Precision Grinding and ED Precision Truing of Metal-bonded Grinding Wheel;
ELID超精密磨削与金属结合剂砂轮电火花精密整形试验研究
17.
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究
18.
Investigation of Multiscale Numerical Simulation of UltraPrecision Cutting Technology;
超精密切削技术的多尺度数值模拟研究