1.
Nickel Electroplating on Surface of Electroless Ni-P Plated Quartz Optical Fiber
预化学镀石英光纤表面电镀镍层的研究
2.
Effects of pH value of surface electroplating Ni to the La-Mg-Ni hydrogen storage electrode
表面电镀镍pH值对La-Mg-Ni系贮氢电极的影响
3.
Study on Ni/Micron Al_2O_3/Nanometer Al_2O_3 Composite Electroplating on Aluminum Alloy;
铝合金表面电镀Ni/微米Al_2O_3/纳米Al_2O_3复合镀层的研究
4.
Study on Ni/micron SiC/nanometer Al_2O_3 Composite Electroplating on Aluminum Alloy;
铝合金表面电镀Ni/微米SiC/纳米Al_2O_3复合镀层的研究
5.
Hybrid Treatment of Chromium Electroplating and Nitriding on Mild Steel;
低碳钢表面电镀铬与氮化复合处理研究
6.
A Study of Prohibiting Permeation of Hydrogen with Cr-C Film Electroplated on the Surface of the Zirconium Hydride;
氢化锆表面电镀铬膜阻止氢渗透的研究
7.
Studies of Electroless Plating Ni-P on Piezoelectric Ceramic and Properties of the Coatings;
压电陶瓷表面化学镀镍磷及镀层性能探讨
8.
Thick nickel electroplating on the surface of electrolessly deposited nickel–phosphorus–boron alloy on quartz optical fiber
石英光纤表面镍-磷-硼化学镀层上电镀厚镍
9.
Electroless Plating Ni-W-P Alloy on Piezoelectic Ceramic;
压电陶瓷表面Ni-W-P合金化学镀
10.
Study of CrN_x Coatings Deposited on 2024 Aluminium Alloys by Multi-Arc Ion Plating
2024铝合金表面电弧镀CrN_x多层膜的研究
11.
Study of Electrodeposits on Electrolytic Copper Foil and Electrodeposition Patterns;
电解铜箔表面电沉积镀层及沉积模型研究
12.
Study on Combined Technique of Electroless Plating Ni-P and Electroplating Ni on Surface of Quartz Optical Fiber;
石英光纤表面化学镀Ni-P和电镀Ni联合工艺研究
13.
The morphology of satin nickel coating with the additives was distinguished to other traditional process observed by SEM.
SEM观察结果表明镀层表面形貌不同于传统珍珠镍电镀工艺所得镀层。
14.
Surface Functionalization and Electroless Copper Deposition of the Fluoropolymer Films;
含氟聚合物薄膜表面功能化及其表面无电电镀应用
15.
The process of anodizing lnvolves the deposition of further oxide on the surface.
阳极电镀的工序就是在表面进一步附着氧化层。
16.
Study on imitation gold electroplating with tartaric acid salt as key complexant on surface of GFRP
玻璃钢表面酒石酸盐体系仿金电镀工艺研究
17.
Study on the Carbon Fiber Powder with Electroless Deposition and Its Electromagnetic Performance;
碳纤维粉表面化学镀及其电磁性能的研究
18.
Electroless Plating of Cu-Ni-P Alloy Film for EMI Shielding on Epoxy Resin Surface;
环氧树脂表面化学镀Cu-Ni-P合金电磁屏蔽膜