1.
sequentially-laminated mulitlayer
顺序层压多层印制板
2.
Improvement of Multilayer Printed Board Quality by Relieving Residual Hot-pressing Stress
层压板热压释放残余应力对多层印制板品质的改善
3.
" Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards"
GB/T12630-1990一般用途的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
4.
ALIVH multilayer printed Board
层间全内导通多层印制板
5.
Test methods for voltage proof of surface layers on printed boards
GB/T7613.2-1987印制板表层耐电压试验方法
6.
Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T12629-1990限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
7.
Test method for insulation resistance within inner layers of multilayer printed boards
GB/T4677.17-1988多层印制板内层绝缘电阻测试方法
8.
Test method for insulation resistance between layers of multilayer printed boards
GB/T4677.18-1988多层印制板层间绝缘电阻测试方法
9.
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
10.
interlayer contact
层间接触-印制电路板的
11.
interlayer continuity
层间连接-印制电路板的
12.
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
13.
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
14.
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
15.
Test methods for copper-clad laminated sheets for printed circuits
GB/T4722-1992印制电路用覆铜箔层压板试验方法
16.
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板
17.
Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board
埋电阻台阶式多层微波印制板制造技术研究
18.
Design and Manufacture of the Multi-Adapter Powder Press Equipment and the Hydraulic System
多层模板粉末压制设备及其液压系统的研制