1.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
2.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
3.
Study on Electrochemistry and Polishing Rate of Chemical Mechanical Polishing of Semiconductor Silicon Wafer;
半导体硅片化学机械抛光电化学与抛光速率研究
4.
One of the two silicified halves of the cell wall of a diatom.
瓣硅藻的两片硅化的细胞壁之一
5.
Electrical Steel Sheet
电器用硅 [硅] 钢片
6.
The method is to coat a wafer of silicon with a protective layer of silicon dioxide.
其方法是往硅片上涂上一层二氧化硅防护膜。
7.
Study on Reducing Core Loss of Silicon Steel Sheet by ECM
电化学加工法降低硅钢片铁损的研究
8.
Topology Optimization Design of the Wafer Handling Robot Arm;
硅片传输机器人手臂的拓扑优化设计
9.
Preparation of Silica Abrasives from Water Glass and Application in Silicon Wafer Polishing
水玻璃为原料制备纳米氧化硅磨料及应用于硅片抛光(英文)
10.
Studies on the Synthesis and Curing Properties of Silicon Functionalized Nornornane Dianhydride
硅烷化降冰片烯二酸酐的合成及固化性能研究
11.
Test method for detection of oxidation induced defects in polished silicon wafers
GB/T4058-1995硅抛光片氧化诱生缺陷的检验方法
12.
Test method for thickness and total thickness variation of silicon slices
GB/T6618-1995硅片厚度和总厚度变化测试方法
13.
Standard method for measuring radial resistivity variation on silicon slices
GB/T11073-1989硅片径向电阻率变化的测量方法
14.
Study on Grinding-based Flattening Theory and Process Technology for Large-sized Silicon Wafer;
大尺寸硅片磨削平整化理论与工艺技术的研究
15.
8 Inch Copper Chemical Mechanical Polish Process vs Wafer Corrosion Defect Reduction Method;
八英寸铜化学机械研磨工艺对硅片腐蚀的改善
16.
Research on Dynamical Characteristics and Structural Optimization for the Wafer Handling Robot
硅片传输机器人的动力学特性与结构优化研究
17.
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
18.
Study on Computer Automatic Measure System about SST of Silicon Stetl Sheet Magnetization Characteristic;
硅钢片单片磁化特性计算机自动测量系统的研究