1.
epoxy pouring sealant for high-voltage focusing potentiometer
高压聚焦电位器环氧灌封胶
2.
epoxy enclosed mica capacitor
环氧包封云母电容器
3.
Preparation and characterization of epoxy encapsulating materials toughened by polyurethane
聚氨酯增韧环氧灌封材料的制备与表征
4.
Epoxy Impregnating Resin with Low Viscosity and High Resistance to High and Low Temperature Shock for Miniature Electronic Components
小型电子元件用低粘度耐高低温环氧灌注胶的研究
5.
The Research of Photoelectric Cathode Transferred and Sealed Technology of Proximity Focused and Imaged Devices
近贴聚焦成像器件光电阴极传递封接工艺研究
6.
A Composite Thermal Conductive Insulating Epoxy Adhesive Material for Electronic Package
电子封装用复合导热绝缘环氧胶粘剂的研制
7.
Properties of Polyurethane-Modified Epoxy Resin Encapsulating Materials Filled with Glass Fiber
玻璃纤维填充聚氨酯改性环氧树脂灌封材料的性能
8.
Application of Silicone to Epoxy Encapsulating Materals and Potting Compound
有机硅在环氧包封料、灌封料中的应用
9.
Study and Design of High Pressure Vessel Based on Rubber O-ring Sealing;
基于O形橡胶圈密封的高压容器设计和研究
10.
1E Class Nomex Paper Non-Encapsulated Dry-Type Transformer in Nuclear Power Station
核电站1E级聚酰胺纸非包封干式变压器
11.
In Situ Polymerized Polyaniline Films under High Pressure;
高压条件下原位聚合导电聚苯胺薄膜
12.
Studies On Epoxy Resin-Low-molecular polyamide-Silver Powder Conductive Adhesive System
环氧-低分子聚酰胺-银粉导电胶体系研究
13.
Adopted liquid polysulfide prepolymer cured at high temperature for sealing cap at the first time.
首次采用液体聚硫橡胶制成预聚体再高温硫化成型,压制新型聚硫橡胶密封帽制品。
14.
Effect of Grafted Particles PGMA/Al_2O_3 on Toughness and Reinforce of Encapsulating Materials of Epoxy Resin
接枝微粒PGMA/Al_2O_3对环氧树脂电子灌封材料的增强增韧作用
15.
Application Development of Epoxidized Natural Rubber in the Modification of Polymers
环氧化天然橡胶在高聚物改性中的应用进展
16.
Study on High Voltage Gradient Zinc Oxide Varistor;
高电位梯度氧化锌压敏电阻片的研究
17.
Preparation and Properties Study on Encapsulating Materials of Epoxy Resin;
环氧树脂灌封材料的制备与性能研究
18.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷