1.
Boundary Scan Technology and Its Application on VLSI Chip s Interconnection Circuit Test;
边界扫描技术及其在VLSI芯片互连电路测试中的应用
2.
Review of Electromigration Modeling of IC Interconnects
集成电路互连线电迁移建模综述(英文)
3.
A Novel Intergrated Circuit Cu Interconnect Process Research;
一种新型集成电路铜互连方法的研究
4.
The Association Connecting Electronics Industries Standardization Work;
美国电子电路与电子互连行业协会标准化工作
5.
Research of Optical Interconnection Waveguides for EOPCB;
光电混合印制电路板（EOPCB）光互连波导研究
6.
Analysis on Electromagnetic Interference of Nonuniform Transmission Lines in High Speed Circuit
高速电路非均匀互连线间电磁干扰分析
7.
Studies on Interconnection Modeling and Timing Optimization for Deep Submicrometer Integrated Circuits;
深亚微米集成电路的互连建模与时序优化
8.
High Speed Front-End Amplifiers Design of Optical Receiver for Optical Interconnect;
用于光互连的高速光接收机前端放大电路设计
9.
On the Applicability of Carbon Nanotubes as Interconnect in Nanoscale Integrated Circuits;
碳纳米管在纳米集成电路互连线中的应用研究
10.
Parameter Extracting of Interconnection Line and Via in High-speed Integrate Circuit;
高速集成电路中互连线与Via结构的参数提取
11.
High Speed Front-end Amplifier Design for Optical Receiver of Optical Interconnection
用于高速光互连的光接收机前端放大电路设计
12.
Methodology for Ultra Deep Sub-micro Integrated Circuit Interconnect Geometric Variation Extraction
超深亚微米集成电路互连线几何变异提取方法
13.
interconnection and connection in electronic equipment
电子设备互连与连接
14.
Pertaining to a line or circuit interconnecting several stations.
用于修饰或说明把若干个站互连起来的通信线路或电路。
15.
Study of Electromagnetic Modeling and Parameters Extraction of On-chip Interconnects in High Speed Integrated Circuits;
高速集成电路片内互连的电磁建模和参数提取研究
16.
Surface Mount Technology and Printed Circuit Board Electrical Interconnection Reliability Research
表面贴装技术（SMT）与印刷电路板（PCB）电器互连可靠性的研究
17.
Interconnection delay has become a dominant factor in IC design.
互连线时延是集成电路设计中非常重要的影响因素。
18.
SSPs are telephone switches, interconnected by SS7 links, that originate, terminate or tandem calls.
SSP 是由 SS7 链路互连的电话交换机，用来发起、终止或汇接呼叫。