1.
chip on board process
基板上芯片装配工艺
2.
An Exploration on the Technology That Brass Is Used as the Core Plate of Copper - base Sintered Friction sheet
黄铜用作铜基烧结摩擦片芯板的工艺探讨
3.
Thermal Design of High-Power LED Multi-Chip on Board Package
大功率LED多芯片基板上直接封装的热设计
4.
Figure 7 shows the sequence for tape bonding the chip and assembling the package.
图7所示为带状引线连接芯片和管壳装配的工艺程序。
5.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
6.
Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究
7.
Fast LED chip position technique base on template projection matching
基于模板投影匹配的LED芯片快速定位方法
8.
The Processes Parameter Controlling of Non-flow Battom Soldering Paste of the FCB Compositon
倒装芯片结构中不流动底部填充工艺参数
9.
Research on Vision-based Automatic Microassembly Oriented to Microfluidic Chip;
面向微流控芯片基于视觉的自动微装配研究
10.
process development chip
工艺过程开发用芯片
11.
The Development of Network Driver for DM9000 on S3C2440 Board in VxWorks;
基于VxWorks的S3C2440开发板上DM9000网络芯片驱动开发
12.
A disk attached to the mandrel of a lathe to hold the work to be turned.
面板安装在车床活动芯轴上以使工件转动的盘
13.
Study on Simulation and Fabrication of Magnetic Bead Microchip Based on MEMS Technology;
基于MEMS技术的磁珠微芯片的模拟及工艺研究
14.
Design of a 2/3-Phase PWM Controller Based on BiCMOS Process;
基于BiCMOS工艺的2/3相PWM控制芯片的设计
15.
By carefully moving the board, the two footprints can be lined up and the chip is lowered into place.
小心移动面板，使这两个封装对齐，把芯片放到其对应的位置上。
16.
Research on the Assembly Process Planning Based on Solid Assembly Model;
基于实体装配模型的装配工艺规划的研究
17.
LED Chip Surface Dirt and Several Anomaly Phenomenon
LED芯片脏污与几种芯片工艺现象的辩识
18.
cutting blade for fitting into tools for machine tools
装配在机床工具上的刀片