1.
Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology
基于多芯片组装技术的小型微波收发前端研制
2.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
3.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
4.
The new chips will not have four cores on a single slice of silicon, but instead consist of two dual-core chips stuck together.
新的芯片将不会在单个硅片上安装四个内核，而是包含两个了2个组合在一起的双核芯片。
5.
Construct cell immuno-chip with tissue microarray technique
应用组织芯片技术构建细胞免疫芯片
6.
chip on board process
基板上芯片装配工艺
7.
Chipsets are key components in computers and other electronic devices that act as nervous systems channelling data between CPUs and other chips.
芯片组是电脑和其它电子装置的关键部件，是CPU和其它芯片之间数据传输的中枢系统。
8.
Characteristics simulation of MEMS packaging using multichip modules technology
基于微机械系统的多芯片组件封装和特性模拟(英文)
9.
Patterning different cells based on microfluidics and self-assembled monolayers
一种基于微流控芯片和电化学自组装单层的多细胞表面构图方法
10.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
11.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
12.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
13.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
14.
take the tracking devi in your phone and embed it in the chip before you hand it over.
在你交出芯片前 把你手机上的追踪装置拆下来 装到芯片上
15.
Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。
16.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
17.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
18.
Design of a Vacuum Adsorption Dumping Gear for Flip Chip
真空吸附式倒装芯片翻转机械手设计