1.
Research of locating bonding points automatically in chip bonding
芯片焊接中焊点自动定位技术的研究
2.
Along with applying in the field of radar and spaceflight, the demand for reliability of chip joint is increasingly high.
随着半导体器件在雷达、空航天等领域的大量应用,对芯片焊接的可靠性提出了越来越高的要求。
3.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
4.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
5.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
6.
Study on metal-cored wire in pipeline automatic welding process
金属粉芯药芯焊丝管道全自动焊接工艺研究
7.
The Analysis of the Connection from BU-61580 To DSP
61580芯片与DSP芯片的连接关系分析
8.
A Method of Automatic Recognition of Bonding Pad and its Application;
一种芯片焊盘自动识别方法及其应用
9.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
10.
film carrier bonding
膜形载体上芯片接合
11.
The operation skill of flux-cored wire CO_2 shield welding in 45° pipe butt welding
管45°对接药芯焊丝CO_2气体保护焊操作技术
12.
high frequency welded spiral fin tube
高频焊接螺旋翅片管
13.
spiral welded-on wing stabilizer
焊接螺旋翼片式稳定器
14.
Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die;
IC芯片粘片机并联焊头机构的动刚度分析
15.
dynamo stator core automatic welder
电机定子铁芯自动焊接机
16.
A Vision-Based Automatic Seam Tracking System for Underwater Flux-Cored Arc Welding
基于视觉传感的药芯焊丝水下焊接焊缝自动跟踪系统
17.
The Method of CO2 Shielded Arc Welding with Stainless Flux-Cored Wire on the Internals of Column
不锈钢药芯焊丝CO_2气体保护焊在塔内件焊接中的应用
18.
A unit composed of an assemblage of pieces welded together.
焊件由许多片焊接在一起的金属片组成的元件