1.
chip on board process
基板上芯片装配工艺
2.
Figure 7 shows the sequence for tape bonding the chip and assembling the package.
图7所示为带状引线连接芯片和管壳装配的工艺程序。
3.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
4.
Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究
5.
The Processes Parameter Controlling of Non-flow Battom Soldering Paste of the FCB Compositon
倒装芯片结构中不流动底部填充工艺参数
6.
process development chip
工艺过程开发用芯片
7.
LED Chip Surface Dirt and Several Anomaly Phenomenon
LED芯片脏污与几种芯片工艺现象的辩识
8.
Tubes of suit go back rotor iron chip with suit, cooperate with relevant equipment , realize iron core rivet automation.
用套装筒套装回转子铁芯片，配合相关设备，实现铁芯铆接自动化。
9.
Study on the Manufacturing Processes of PMMA Integrated Capillary Electrophoresis Chips;
PMMA集成毛细管电泳芯片制作工艺研究
10.
Studies on Key Processes and Techniques of PDMS Microfluidic Chips;
PDMS微流控芯片关键工艺技术研究
11.
Design of LVDS Monolithic Transceiver in 0.5μm CMOS Technology
0.5μm CMOS工艺LVDS单芯片收发器设计
12.
Fabrication of glass/PDMS micro-fluidic chips
玻璃-PDMS微流控芯片制备工艺
13.
Development Status of Production Process and Equipment of Flux-cored Welding Wire
药芯焊丝生产工艺及装备的发展状况
14.
Monolithically Integrated Optical Receiver with Spatially Modulated Optical Detector in CMOS Technology
标准CMOS工艺下单片集成光接收芯片的研究
15.
Research on Applying Constant Current/voltage to Control Sample Loading and Dispending in Microfluidic Chips;
微流控芯片中样品装载与分配的恒流/恒压控制
16.
Research on Vision-based Automatic Microassembly Oriented to Microfluidic Chip;
面向微流控芯片基于视觉的自动微装配研究
17.
Research on Assembly System for Microfluidic Chips and Related Techniques;
面向微流控芯片的微装配系统及相关技术研究
18.
Improving the Assembly Process to the Washer for Adjusting the Valve Clearance in Diesel Engine by Measuring Tools
借助量具改进柴油机气门间隙调整垫片装配工艺