1.
The microcapsules are suspended in a substance similar to vegetable cooking oil.
微型封装块悬浮在像食用油那样的物质中。
2.
STRUCTURE AND ANALYSIS OF A COMPACT DEWAR BOTTLE PACKAGE OF INFRARED DETECTOR
红外探测器封装微型杜瓦瓶结构与分析
3.
Comparative Research of Micro-BGA Reliability Under Bending Stress
弯曲应力状况下微型BGA封装可靠性比较
4.
FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING
微电子封装钎料时相关本构模型的有限元实现
5.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
6.
Study on Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in Microelectronic Packaging;
微电子封装中无铅焊料的损伤模型和失效机理研究
7.
Time-Dependent Damage Coupled Constitutive Model of Solder Alloy in Micro-Electronic Packaging at High Tempertaure and It's Application;
微电子封装钎料高温时相关耦合损伤本构模型及其工程应用
8.
UV Curing Technique for Micro Direct Methanol Fuel Cell Packaging
紫外固化技术在微型直接甲醇燃料电池封装中的应用(英文)
9.
Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-ray tubes and nanoCT
纳米焦点X射线管和纳米CT检测集成电路封装中的微型互联(英文)
10.
TQFP (Thin Plastic Quad Flat Pack
薄型方面平面封装)
11.
Microprocessor: The central processing unit of a microcomputer. The microprocessor is contained on a single integrated circuit chip.
微处理器:微型计算机的中央处理单位.封装在一枚单一集成电路薄片上.
12.
EFFECT OF POTTING ON THE PACKAGING OF HIGH-G MEMS ACCELEROMETER
灌封对高量程微机械加速度计封装的影响
13.
microelectronic modular assembly
微电子学微型组件装置
14.
Microsystem Technology (Serials Four)──Packaging Technologies
微系统技术（连载四）──封装技术
15.
Investigation of the Glass-ceramics Used for Anodic Bonding Material in MEMS;
MEMS封装用静电键合微晶玻璃的研究
16.
Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究
17.
Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;
微电子封装高聚物热、湿—机械特性及其封装可靠性研究
18.
Study on Integration and Packaging of Monolithic Microwave Micro-plasma Source
单片微波微等离子体源的集成与封装研究