1.
The Establishment and Solution of a Shape Model of Soldered Joints of Surface Mount
表面组装焊点形态模型的建立及求解
2.
Study on the Reliability of SMT Solder Joint in Electronic Packaging;
电子封装中表面贴装焊点的可靠性研究
3.
Solder Joint Shape Prediction of Microelectronics Assembly Surface Mount Component
微电子组装表贴元件焊点三维形态预测
4.
Research of Reliability of SMT Soldering Pad Design
表面组装元器件焊盘设计的可靠性研究
5.
Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint;
倒装焊焊点中金属元素迁移及组织演变
6.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
7.
Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly.
在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。
8.
Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.
需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。
9.
The Research on Reliability and Pb Contamination of Microelectronic Assembly Solder Joints;
微电子组装焊点可靠性及其铅污染问题的研究
10.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性
11.
Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;
电子封装中无铅焊点的界面演化和可靠性研究
12.
Study of Flux for Microelectronics Soldering and Microstructure of Solder Joint;
微电子焊接助焊剂及其焊点组织研究
13.
The assemblies of the whole Body is combined by spot welding and Bolting.
整个车身的所有装配件都是由点焊或螺栓组装起来的。
14.
Research on the Reliability of Solder Joints in Mixed Assembly and Structure Parameter Optimization of PBGA in Lead-free Transition
无铅过渡时期混合组装PBGA焊点可靠性及封装体结构参数优化研究
15.
Locator Optimization for Resistance-spot-welding Fixtures
电阻点焊焊装夹具定位点的优化设计
16.
The Study of Deposition of TiC on the Electrode Tip Surface of Resistance Spot Welding by Vibrating Electric Sparking;
点焊电极表面振动电火花熔敷TiC的研究
17.
Characteristics of TiB_2 coating on surface of copper electrode prepared by electrospark deposition
点焊电极表面电火花沉积TiB_2涂层的特征
18.
SMT Solder Joint 3D Reconstruction Technology Based on Shape from Shading
基于SFS原理的SMT焊点表面三维重构技术研究