1.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
2.
The Study on Reactive Wettability of SnAgCu Solder Alloy on Au/NiFe/Cu PAD
SnAgCu钎料合金在Au/NiFe/Cu焊盘上的反应润湿研究
3.
The Microstructure and Properities of the Joint of Si_3N_4 Ceramics by Au-Ni-V Brazing Alloy;
Au-Ni-V钎料钎焊氮化硅陶瓷接头的组织及性能研究
4.
Effect of Minor Cu on Microstructure and Welding Performance of Au-24Ag-3.25Si Brazing Alloy
微量Cu元素对Au-24Ag-3.25Si钎料合金组织和焊接性能的影响
5.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
6.
Effect of Cu and Ni on microstructure and properties of Sn-Zn-Al lead-free solders
Cu,Ni对Sn-Zn-Al无铅焊料组织和性能的影响
7.
Magnetocaloric Effect of Ni-Cu Thermoseed Used in Magnetic Inductive Therapy and Effect of Au Coating on the Heating Efficiency
磁感应治疗用Ni-Cu合金铁磁热籽的磁热效应及Au镀层对发热效率的影响
8.
Integrative Process of Vacuum Brazing and Heat-treating for Cu-Ni-Be Alloy and T2 Copper
Cu-Ni-Be合金与T2铜真空钎焊及热处理一体化工艺研究
9.
Study on Heteroepitaxial Growth of Au/Cu,Ag/Cu and Cu/Au System by Molecular Dynamics Dynamics Simulation;
Au/Cu、Ag/Cu及Cu/Au体系异质外延生长的分子动力学研究
10.
Mechanical Properties of Si/DLC Films on Au and Au-Cu Substrates
以Au和Au-Cu为衬底的Si/DLC薄膜的机械性能(英文)
11.
Microstructure and Property of SiCf-reinforced Titanium Based Composite Joint Using Ti-Zr-Cu-Ni Brazing Filler
采用Ti-Zr-Cu-Ni钎料钎焊SiC纤维增强钛基复合材料的接头组织与性能
12.
The Study of the Characteristics of Ni/Au Schottky Contact on GaN;
GaN基Ni/Au肖特基接触特性研究
13.
X-Ray Excited Luminescence Property of ZnS∶Au,Cu Fine Particles Synthesized by Hydrothermal Method
水热法合成ZnS∶Au,Cu超细X射线发光粉
14.
Formate Adsorption on Cu(110), Ag(110) and Au(110) Surfaces
HCOO在Cu(110)、Ag(110)和Au(110)表面的吸附(英文)
15.
Effect of Nickel on Cu-Ni/γ-Al_2O_3 Catalyst Used in Benzene Hydroxylation Reaction
Ni对Cu-Ni/γ-Al_2O_3苯羟基化催化剂的影响
16.
Influence of p-GaN/Ni/Au ohmic contact characteristics by Zn~+ implantation
Zn~+注入对p-GaN/Ni/Au欧姆接触特性的影响
17.
Preparaton,Characterization and Catalytic Performance of Au-Ni/γ-Al_2O_3 Catalyst
Au-Ni/γ-Al_2O_3催化剂的制备、表征及催化性能
18.
The Energy and Structure of Low Index Twist Grain Boundary for Noble Metals Au, Ag and Cu;
贵金属（Au、Ag、Cu）低指数扭转晶界的能量和结构