1.
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
化学镀铜层的显微结构受基体的显著影响。
2.
Influences of Several Additives on Performance of Electroless Copper Coating on Ceramics
几种添加剂对陶瓷化学镀铜层性能的影响
3.
Metallic coatings-Electroplated coatings of copper for engineering purposes
GB/T12333-1990金属覆盖层工程用铜电镀层
4.
The assembly shall have a electroless nickel-plated tubular copper body.
这种总成应该具有非电镀镀镍层管状铜阀体。
5.
Researches on Processes of Electroplating Zinc and Cu/Ni/Cr on AZ91D Magnesium Alloy;
AZ91D镁合金电镀锌及铜/镍/铬组合镀层工艺研究
6.
PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY
钨铜合金表面化学镀Ni-P镀层性能研究
7.
To coat or finish with a layer of copper.
镀铜于给…包铜或镀铜
8.
Zinc-coated steel wire-Test method for uniformity of zinc coating on wire by the copper sulphate dip
GB/T2972-1991镀锌钢丝锌层硫酸铜试验方法
9.
Preparation of Cu/Sn composite coatings with electric magnetic shielding
铜/锡复合镀层电磁屏蔽织物的研制
10.
Study on electrodeposition process and properties of copper–tungsten composite coating
铜-钨复合镀层电沉积工艺及其性能
11.
Cobalt-tungsten electrodeposit as copper barrier was presented in the paper.
本文提出以电镀钴钨二元合金镀层作为防铜渗层。
12.
Gold electrodeposit as top coating of artificial jewelry made of copper and copper alloy tarnished because of copper diffusion to gold top deposit.
铜和铜合金饰品表面需镀金，由于铜扩散至镀金层表面，引起金层变色。
13.
Metallic coatings-Electroplated coatings of copper plus nickel plus chromium on plastics materials
GB/T12600-1990金属覆盖层塑料上铜+镍+铬电镀层
14.
Evaluation of Tin Coatings on Bronzes of Ancient China;
春秋时期镀锡青铜器镀层结构和耐腐蚀机理研究
15.
Iron or steel placed in copper sulfate also receives a loose immersion deposit.
铁或钢放入硫酸铜中，也会生成疏松的浸镀层。
16.
The assembly shall have an electroless nickel-plated tubular copper body.
这种总成应该采用非电解镍镀层铜阀体。
17.
A Research on the New Technique for Rapid Stripping of Cu/Ni/Cr Deposits
快速退除铜/镍/铬等金属镀层新工艺的研究报告
18.
Study of Electrodeposits on Electrolytic Copper Foil and Electrodeposition Patterns;
电解铜箔表面电沉积镀层及沉积模型研究