1.
Study on Microstructure and Properties of QTi2.5/Cu Films Prepared by Arc Ion Plating
电弧离子镀QTi2.5/Cu镀层组织与性能分析
2.
Preparation and Thermal Stability of Ni(-Mo)-P/Cu Alternate Multilayers;
Ni-（Mo）-P/Cu多层交替镀层的制备及其热稳定性
3.
Preparation and Properties Study of Electroless Ni-Cu-P Deposition on Aluminum Alloy;
铝合金表面Ni-Cu-P镀层的制备及其性能研究
4.
Preparation and Property of Cu-Sn-P-ZrO_2 Electroless Nanometer Composite Coating;
纳米复合材料镀层Cu-Sn-P-ZrO_2的制备和性质研究
5.
Investigation on Electrodeposition of Bronze-PTFE Composite Coatings on Stainless Steel Substrate
不锈钢基体电沉积Cu-Sn-PTFE复合镀层的研究
6.
Research on TiN-Cu Super-hard Nano-composite Coating Prepared by Multi-arc Ion Plating
多弧离子镀制备TiN-Cu超硬纳米复合涂层的研究
7.
Antibacterial Performance of Electroless Ni-Cu-P/Nano-TiO_2,Composite Coating on AZ91D Magnesium Alloy
AZ91D镁合金Ni-Cu-P/纳米TiO_2化学镀层的抗菌性能
8.
Research on the Diffusibility of an Engine Cu-Pb Bearing with Soft Plating Coat
发动机Cu-Pb轴瓦软镀层的扩散性能研究
9.
Study on Composite Electroplating Process of Cu-W and Arc Erosion Property of Composite Coating
Cu-W复合电沉积工艺和镀层电弧侵蚀性能研究
10.
Research of Micro-Pattern Electroless Ni-P/Cu Plating Technology and Coating Structure;
微元图形化学镀Ni-P/Cu工艺与其镀层组织的研究
11.
Research on Wear Behavior of Ni-Cu-P Coacting in Different Mediums
化学镀Ni-Cu-P镀层在3种腐蚀介质中冲蚀行为的研究
12.
Local corrosion of electrodeposited multi-layers of AZ91D magnesium alloy and its processing of electroless plated Ni-P-Cu layers
AZ91D镁合金表面复合镀层局部腐蚀现象解析及化学镀Ni-P-Cu的研究
13.
Study on Amorphous Ni-Cu-P Alloy Chemical Plating for New Type of Ammunition Packaging Material
化学镀非晶态Ni-Cu-P合金镀层作为新型弹药包装材料的耐环境试验研究
14.
QTi2.5/Cu same basic alloy ion plating
QTi2.5/Cu同基合金离子镀
15.
Magnetocaloric Effect of Ni-Cu Thermoseed Used in Magnetic Inductive Therapy and Effect of Au Coating on the Heating Efficiency
磁感应治疗用Ni-Cu合金铁磁热籽的磁热效应及Au镀层对发热效率的影响
16.
Study on Arc Ion Plating with Magnetron of Same Basic Component for Both Deposited Layer and the Substrate (H62/Cu和QAl9-4/Cu);
H62/Cu和QAl9-4/Cu同基合金磁控电弧离子镀研究
17.
Research on Property of Electroless Ni-Cu-P and Composite Coating of Ni-Cu-P-Nanoparticles;
化学镀Ni-Cu-P合金及其纳米粒子复合镀研究
18.
Cupric Sulfate Plating Process Cu-BRITE TFⅡ for Through-Hole and Via Filling Plating
导通孔和通孔填孔镀用的CuSO_4电镀工艺“Cu-BRITE TFⅡ”