1.
Main materials of printed circuit board (PCB) substrate were macromolecule resins, which were typical viscoelatic materials.
电路板基板材料主要以高分子树脂为主，是典型的黏弹性材料。
2.
Low transmission loss halogen-free PCB base material
低传输损失无卤PCB基板材料的发展(一)
3.
Development of New Epoxy Resin for PCB Base Materials
PCB基板材料用新型环氧树脂发展综述
4.
Transformation of Market and Progress of Product about PCB Substrate Material in Japan;
日本PCB基板材料业的市场转变与产品发展
5.
Research Progress in Thermal Conductivity and Sintering Additives of AlN Packaging Material
AlN陶瓷基板材料热导率与烧结助剂的研究进展
6.
Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(6)--Base Material R-1755D for Automobile PCB from Matsushita Electric Works
世界覆铜板新产品新技术赏析(6)——松下电工汽车PCB用基板材料R-1755D
7.
Durability of GFRP composites laminate with epoxy-organoclay nanocomposite matrix
纳米复合材料基GFRP板材耐久性研究
8.
Fabrication of Nano-porous SiC-based Ceramics Using Template Method;
模板法制备SiC基陶瓷纳米孔结构材料
9.
Preparation and Properties of Glass Ceramic Materials for LTCC
LTCC基板用玻璃陶瓷材料的制备及性能
10.
A thin surface layer, as of finely grained wood, glued to a base of inferior material.
饰面薄板；镶板粘在低质材料的基部的薄表层，如有精细木纹的木板
11.
Growth of AlGaN films with different Al fraction on AlN template
基于AlN基板的不同Al组分的AlGaN材料生长
12.
Appraisal of Material Property and Strain Analysis on Cherokee Panel - CowlAir Chamber
切诺基前围空气室板应变分析与材料性能评价
13.
Fabrication and Study of One-Dimension Functional Material Based on AAO Template;
基于AAO模板的一维纳米功能材料制备与研究
14.
Design on Blankholding Force for High Strength Steel Based on Strain Hardening;
基于材料硬化的高强度钢板压边力设计方法
15.
The Residual Stress Analysis of Tial-Based Alloy and Composite Sheet;
TiAl基合金及其复合材料薄板的残余应力分析
16.
Inverse Identification of Materials Imployed in Sheet Metal Simulation Based on the Combination of the Finite Element Method (FEM) and the Genetic Algorithm (GA);
基于micro GA和有限元的薄板材料参数的反求
17.
Study on Novel Carbon-based Composite Pantograph Slide for Electric Locomotive;
新型电力机车受电弓碳基复合材料滑板研究
18.
Composite Laminate Theory Based Dynamic Pavement Response
基于复合材料层合板理论的路面动力响应研究