1.
Application of PTC polymer on RF thermal fusion surgical devices
正电阻温度系数高分子在外科热封合器械中的应用
2.
Analysis of temperature field and coupled thermal and structure for finger seal
指尖密封的温度场及热结构耦合分析
3.
Research of Sealing and Heat-insulating Coating on Composite Case External Surface
复合材料壳体外表面密封、隔热涂层材料的研究
4.
Research on Heat Seal Technology and Mechanism of Plastic Packaging Laminated Materials;
软塑复合包装材料热封工艺及其机理研究
5.
A Composite Thermal Conductive Insulating Epoxy Adhesive Material for Electronic Package
电子封装用复合导热绝缘环氧胶粘剂的研制
6.
Research and Development on Thermal Conductivity of SiC/Al Composites Applied to Electronic Packaging
电子封装SiC_p/Al复合材料导热性能研究与进展
7.
sealing regenerative-type air preheater
密封回热式空气预热器
8.
PET/ pIated AL/ PE, PET/ PP, NYLON and other heatabIe sealed laminates films etc.
聚酯/铝/乙烯，聚酯/丙烯，尼龙复合薄膜等可热封的复合包装材料。
9.
PET/ plated AL/ PE, PET/ PP, BOPP film, NYLON and other heatable sealed laminates films etc.
聚酯/铝/乙烯，聚酯/丙烯，BOPP薄膜、龙复合薄膜等可热封的复合包装材料。
10.
a resinous composition that is plastic when warm; used for sealing documents and parcels and letters.
一种树脂质的混合物，加热后呈塑胶状；用于密封文件、包裹和信件。
11.
Study on the Process of W/Cu Composites with Low CTE and High TC Used for Electronic Packaging;
电子封装用低膨胀高导热钨铜复合材料的工艺研究
12.
A Study of Tungsten-Copper Composites Materials with Low CTE and High TC Used for Electronic Packaging;
电子封装用高导热低膨胀率W/Cu复合材料的研究
13.
Finite Element Analysis of Chip-on-Glass Warp Behavior Due to the Thermal and Mechanical Loading
用有限元方法分析玻璃载芯片封装中的热力耦合问题
14.
THE EFFECT OF THERMO-OXIDIZING AND SHEAR STABILITIES OF LINKED POLYMER SOLUTION ON ITS PLUGGING EFFICIENCY
交联聚合物溶液的热氧化及剪切安定性对其封堵性能的影响
15.
Presureless Infiltration and Thermal-properties of SiC Porous Ceramics Reinforced Al Composites for Electronic Packaging
SiC/Al基电子封装复合材料的无压浸渗法制备与热性能研究
16.
An enclosure in which energy in a nonthermal form is converted to heat, especially such an enclosure in which heat is generated by the combustion of a suitable fuel.
火炉一种把能量从非热能形式转化为热量的封闭体，尤指通过合适燃料的燃烧产生热量的封闭体
17.
Thermal Analysis of LED Packages based on Heat Pipe Heat Sink
基于热管散热的LED器件封装热分析
18.
non-enveloped thermistor
非密封型热敏电阻器