说明:双击或选中下面任意单词,将显示该词的音标、读音、翻译等;选中中文或多个词,将显示翻译。
您的位置:首页 -> 句库 -> 密封摩擦
1.
Fractal Characteristics of End Faces' Topography in Friction Pair of Mechanical Seals
机械密封摩擦副端面形貌的分形特性
2.
Study on Dry-Friction Mechnical Seal in the Condition of Low Speed and High Pressure
高压低速干摩擦机械密封性能的研究
3.
Experimental Investigation into Friction State of End Faces of GY70 Mechanical Seal
GY70型机械密封端面摩擦状态试验研究
4.
The silicon carbide has the advantages of excellent corrosion resistance, high coefficient of heat conductivity, self-lubricity, small expansion.
简要说明:碳化硅密封环是机械密封中用途最广的摩擦材料。
5.
The freely parallel sliding, no attrition with other elements.
门扇自由滑行,不与任何密封胶条产生摩擦.
6.
Small open torque, seat almost without attrition and long serving life.
开启力矩小,密封副无摩擦转动,阀门使用寿命长。
7.
Measurement Methods for Frictional Torque of Mechanical Seals Based on LabView
基于LabView的机械密封端面摩擦扭矩的测量方法
8.
Introduce and Application of Frictionless Hermetic Damper
金属密封无摩擦阻尼器介绍及工程应用
9.
Tribological Characteristic of Packing Rings for Oil-free Lubricated Gas Compressors
无油润滑空压机填料密封环的摩擦特性
10.
Application and Market Outlook of Glass Fiber Friction and Sealing Materials
玻璃纤维在摩擦、密封材料中的应用及市场前景
11.
Friction Force Study on Picking Rings for Oil-Free Lubricated Gas Compressors
往复式无油润滑压缩机填料密封的摩擦力研究
12.
Research for Mixing Friction in Mechanical Seal Based on Micropolar Fluid Lubrication Theory;
基于弹性微极流体润滑理论机械密封混合摩擦的研究
13.
Research on Friction and Abrasion Mechanism of Piston Ring Type Seal in High-speed and High-pressure Condition
涨圈密封在高速高压条件下的摩擦与磨损机理研究
14.
EXPERIMENTAL RESEARCHES ON THE SLIDE-DAMPING ISOLATOR WITH SEALING COVER AND DISPLACEMENT-LIMITED COMPONENTS
一种全密封锁位型摩擦阻尼隔震支座的试验研究
15.
Frictional torque of oil film face seals in hydraulic sliprings based on ANSYS and MATLAB
基于ANSYS和MATLAB的液压滑环端面油膜密封的摩擦转矩研究
16.
Sintered metal friction materials-Determination of density
GB/T10421-1989烧结金属摩擦材料密度的测定
17.
Study on Abrasive Polishing Assisted Precision Electroforming Using Orbital Movement Cathode
阴极平动式摩擦辅助精密电铸的研究
18.
Research on Friction Analysis and Compensation for the High-Speed & High-Accuracy IC Packaging Platform;
高速高精芯片封装平台的摩擦分析及补偿研究