1.
Study on Performance of the Pb-Sn Alloy Deposits on Aluminum Prepared for Light-type Grid;
铝基电镀铅锡合金轻型板栅的制备及性能研究
2.
Metallic coatings--Electroplated coatings of tin-lead alloys
GB/T17461-1998金属覆盖层锡--铅合金电镀层
3.
Study on Bright Tin-Lead-Bismuth Alloy Electroplating Technology with Methylsulfonic Acid Bath
甲磺酸电镀光亮锡-铅-铋合金工艺研究
4.
Research on Electrodepositing on Aluminum Alloy Grid for the Cathode of the Valve-regulated Lead-acid Batteries;
阀控式铅酸蓄电池电镀铝合金负极板栅的研究
5.
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition
电沉积制备Sn-Cu无铅钎料电镀工艺的研究
6.
Aplataer process
热镀锌法 -铅锌法热镀锌
7.
Study on Lead-free Weldable Coating of Chip Electronic Components
片式电子元器件中无铅可焊镀层的研究
8.
STUDY OF BRIGHT Pb-Sn ALLOY PLATING OF CITRIC ACIDAMMONIUM ACETATE BATH
柠檬酸-醋酸铵体系光亮铅锡合金电镀工艺研究
9.
This workshop covers lead-free surface finishes for components, connectors and print circuit board.
这次课程涵盖了元件、接器和印刷电路板的无铅表面镀层。
10.
The most commonly used letterpress duplicate plates are stereotypes,electrotypes,plastic plates and rubber plates.
活版最常用的复制版有铅铸版、电镀版、塑胶版和橡胶版。
11.
The classification, characteristics, and application results of tin, tin-lead and tin-bismuth electroplating were summarized.
总结了电镀锡、铅合金和锡铋合金的分类、点及应用情况。
12.
Lead is also a common constituent of plating wastes, although not so frequently encountered as copper, zinc, cadmium and chromiurn.
尽管铅不如铜、锌、镉和铭那样常见，但它却是电镀废水中的普通组分。
13.
filled gold
镀金的金属(铜、铁、铅等)
14.
Determination of Pb and Cd in the Coating of the Zinc-Coated Steel Sheets by ICP-AES;
ICP-AES法测定镀锌板中镀层的铅和镉
15.
Methane sulphonic acid (MSA) has the right combination of properties for electroplating baths containing lead, tin, copper, nickel and some precious metals.
在含有铅、锡、铜、镍和一些贵金属的电镀池中,甲磺酸(MSA)是一种很好的电解质。
16.
A metal plate used in letterpress printing, made by electroplating a lead or plastic mold of the page to be printed.
电铸版用于凸版印刷的金属版，由电镀所印页的铅或塑料模版而制成
17.
To galvanize or plate(metal)by immersion.
电镀通过浸泡镀涂金属
18.
Electro galvanized Steel Sheet
电镀锌(电解)钢片