1.
It was proved thet the pooperties of the bath is stable,the deplsition rate is considerably high,the edposited layer possess fairly high hardness and good adhesive power to the substrate.
试验结果表明:镀液性能稳定,镀层沉积速度快,镀层硬度高、质量好、结合强度大。
2.
Effect of electroless Ni-P-Diamond composite plating parameters on the micro-hardness of coating
Ni-P-金刚石化学复合镀研究工艺对镀层硬度的影响
3.
Influence of Surfactants on Ni-nano-TiO_2 Composite Coatings
表面活性剂对Ni-纳米TiO_2复合镀层硬度的影响
4.
In addition, the effect of thermal treated temperature on hardness and coercive force of cobalt-boron alloy deposit was studied.
另外，研究了热处理温度对镀层硬度和矫顽力的影响。
5.
A Study of Micro-hardness of Fe-Zn Alloy Obtained by Electroless Plating
化学镀Fe-Zn镀层的显微硬度实验研究
6.
Analysis on Microstructure and Hardness of Brush Plating Coating on High Temperature Resistance Alloy
耐高温合金电刷镀镀层显微组织及硬度分析
7.
Influence of Ti target current on microstructure and hardness of CrTiAlN coatings prepared by magnetron sputtering
Ti靶电流对CrTiAlN镀层组织结构及硬度的影响
8.
MICROHARDNESS OF Ni-Co ALLOY PLATED BY HIGH FREQUENCY PULSE CURRENTS
高频脉冲电沉积镍钴合金镀层的硬度研究
9.
Research of Ni-P Gradient Coating and Ni-P/SiC Gradient Coating;
Ni-P梯度镀层及Ni-P/SiC梯度镀层研究
10.
Mass Calculation of coating (For equal coating)/MM
锌镀层质量(两个相同锌镀层厚度)
11.
The adhesive strength of the acid film was stronger than that of the alkali film.
碱性镀层的结合强度优越于酸性镀层。
12.
Effect of temperature on the quality of electro-deposited Nickel-Tungsten coating
温度对镍钨合金镀层电镀质量的影响
13.
The Influence of the Temperature and Time on the Galvanized Coating;
浸镀温度和浸镀时间对热浸镀锌镀层组织的影响
14.
Current Status and Development Trend of Electroplated Cobalt Alloy and Composite Coatings as Replacements of Electroplated Hard Chromium Coatings
替代硬铬的镀钴合金及其复合镀层的研究现状及展望
15.
Effect of Cathode Current Density on Quality of Ni-W Alloy Coating
阴极电流密度对电镀Ni-W合金镀层质量的影响
16.
Vacuum Metal Deposition for Development of fingerprints:Influence of Quantities of Gold on Size and Density of Clusters
真空金属镀膜显现指印:镀金量对镀层尺寸和密度的影响(英文)
17.
Effects of NiSO_4 content in plating bath on the quality of Ni-W alloy coating
镀液中硫酸镍浓度对镍钨合金镀层电镀质量的影响
18.
Superhard Multilayer Films Prepared by Pulsed Bias Arc Ion Plating;
脉冲偏压电弧离子镀沉积超硬多层薄膜