1.
Gold wire for semiconductor devices lead bonding
GB/T8750-1997半导体器件键合金丝
2.
The Design and Analysis of Millimeter-wave Microstrip Bonding Wires for Wide-Bandwidth Matching Interconnection
毫米波微带键合金丝宽带匹配互连分析设计
3.
A Study on Industrialized Technology of Golden Bonding Wires for Semi-condutor Integrated Circuit Components;
半导体器件集成电路用键合金丝产业化技术的研究
4.
Intermetallic Compounds Formation and Reliability on Bonding Joints of Copper Wire and Gold Wire with Aluminum Alloy Pad;
铜及金丝与铝合金焊盘键合的金属间化合物生长和可靠性
5.
SPC Quality Control for Gold Wire-bonding
统计过程控制用于金丝键合质量控制研究
6.
Application of Novel Image Matching Algorithm in Golden Wire Bonder
新图像匹配算法在金丝球引线键合机中的应用
7.
a copper pipe, wire, alloy, etc
铜管、 丝、 合金等
8.
Research on the Key Technology of Wire Feed System of Automatic Wire Bonder;
全自动金丝球焊机快速送丝系统关键技术研究
9.
Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire
高性能键合铜丝的制备及其球键合工艺研究
10.
Alloy structure steel wires
GB/T3079-1993合金结构钢丝
11.
Titanium and titanium alloy wire
GB/T3623-1998钛及钛合金丝
12.
Molybdenum-tungsten alloy wires
GB/T4183-1984钼钨合金丝
13.
Tungsten rhenium alloy wires
GB/T4184-1984钨铼合金丝
14.
Aluminium-titanium alloy wires
GB/T3129-1982铝钛合金丝
15.
Fracture Reason of GH1040 Thread in Manufacture
生产GH1040合金丝时的断丝原因
16.
Fine aluminum-1% silicon wire for semiconductor lend-bonding
GB/T8646-1998半导体键合铝--1%硅细丝
17.
Study on the Key Techniques of Large-Capacity Complex Spinning Component
大容量复合纺丝组件的关键技术研究
18.
Kin alloy silk, gold rake thin (manufacturing); Evaporation gold (sales).
健合金丝、金耙材（制造）；蒸发金（销售）。