1.
copper phosphide containing more than 15% by weight of phosphorus
磷化铜,含磷重量超过15%者
2.
Electroless Ni-P/Ni-Cu-P Coatings on AZ91D Magnesium;
AZ91D镁合金化学镀镍磷/镍铜磷
3.
Copper and copper alloys--Determination of phosphorus content
GB/T5121.2-1996铜及铜合金化学分析方法磷量的测定
4.
A Study on the Technology of Electroless Copper Plating with Sodium Hypophosphite as Reductant;
以次亚磷酸钠为还原剂的化学镀铜工艺研究
5.
Catalytic Degradation of P-nitrophenol with Hydrogen Peroxide over Copper Hydrophosphate
羟基磷酸铜催化降解对硝基苯酚的研究
6.
Influence of Maleic Acid on the Deposition Behavior of Sodium Hypophosphite Electroless Copper Plating
马来酸对次磷酸钠化学镀铜沉积行为的影响
7.
Influences of K4Fe(CN)_6 on Electroless Copper Plating Using Hypophosphite as Reducing Agent
亚铁氰化钾对以次磷酸钠为还原剂化学镀铜的影响
8.
Effects of NP Fertilizers on Activity of Copper and Lead in Meadow Cinnamon Soil and Their Phytoavailability;
氮磷化肥对潮褐土铜铅活性及其植物效应的影响
9.
Study on Treatment of Pyrophosphate Copper Plating Wastewater by Synthesizing LDH in Situ;
即时合成层状双氢氧化物处理焦磷酸盐镀铜废水的研究
10.
A Study on the Technology of Electroless Copper Plating of Wood with Sodium Hypophosphite as Reductant
以次亚磷酸钠为还原剂的木材化学镀铜工艺研究
11.
Synthesis,Structure and Properties of A Hybrid Material Based on Polyoxoanion and Copper Phosphate
多阴离子和铜磷酸盐为基元的杂化材料的合成、结构和性质(英文)
12.
The Effects of PON1 on the Production of Pyocyanin of Pseudomonas Aeruginosa and the Oxidative Damage of Cells by Pyocyanin
对氧磷酶1对铜绿假单胞菌绿脓素生成及其细胞氧化损伤的影响
13.
In this case the potato provides phosphoric acid, which enables a chemical reaction causing electrons flow from copper to zinc.
在我这个装置中，土豆提供了磷酸，磷酸通过化学反应让电子从铜逃向锌。
14.
Rapid Determination of Cupric Pyrophosphate and Potassium Pyrophosphate in Copper Plating Solution
镀铜液中焦磷酸铜和焦磷酸钾的快速分析
15.
Copper phosphorus alloys. Useful for braze copper-copper or copper-brass, using flux.
以铜和磷为主要成份，用于铜-铜或铜-铜合金的焊接，需要使用助焊剂。
16.
Research on High-performance Tin Phosphorus Bronze C5210 Copper
高性能锡磷青铜C5210铜箔研究
17.
Characteristics of Amorphous Brazing Ribbon of Cu-P Based Alloy
非晶态铜磷钎料真空钎焊紫铜的性能
18.
Oxidize copper to copper oxide.
使铜氧化变成氧化铜。