1.
Prediction of Laser Spot Weld Shape by Using Artificial Neural Network
基于人工神经网络的激光点焊焊点形态预测
2.
Solder Joint Shape Prediction of Microelectronics Assembly Surface Mount Component
微电子组装表贴元件焊点三维形态预测
3.
Forming For Resistance Spot Welding of Non-thick Dissimilar Steel and Neural Network Prediction
非等厚异种钢电阻点焊焊点成形及神经网络预测
4.
Study on Fatigue Damage and Life Prediction Based on Dynamic Response Frequency for Double-Spot Welded Joints;
基于动态响应频率的双点焊接头疲劳损伤及寿命预测
5.
Fatigue Damage and Life Prediction Based on Dynamic Response Characteristics for Spot-Welded Joints under Variable Amplitude Loading;
基于动态响应特性的点焊接头变幅疲劳损伤与寿命预测
6.
Fatigue Damage and Life Prediction Based on Dynamic Response Analysis for Spot-Welded Joints;
基于动态响应分析的点焊接头疲劳损伤与寿命预测
7.
Fatigue Life Prediction Based on Dynamic Response Characteristics for Spot-welded Joints under Variable Amplitude Loading
变幅加载下基于动态响应特性的点焊接头疲劳寿命预测
8.
Prediction for welding deformation reducing by welding sequence optimization of upper plate
顶板焊接顺序优化减小焊接变形的预测
9.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
10.
Welding Deformation Predicting, Controlling and Applying for Box Structure;
箱型结构焊接变形预测、控制及应用
11.
Prediction of Welding Deformation & Residual Stress by FEM;
用有限元法预测焊接变形和残余应力
12.
Parametric Welding Deformations Prediction of Ship Hull Blocks;
参数化的船体平板分段焊接变形预测
13.
The Establishment and Solution of a Shape Model of Soldered Joints of Surface Mount
表面组装焊点形态模型的建立及求解
14.
Research on Condition Monitoring of Spot Welding Equipment Based on LabVIEW
基于LabVIEW的点焊设备状态监测系统研究
15.
DETERMINATION OF ANAND PARAMETES FOR Pb-FREE MATERIAL SnAgCu AND LIFE PREDICTION FOR A CSP STRUCTURE
无铅材料SnAgCu的Anand参数测定和CSP焊点寿命预测
16.
Study on SMT Solder Joints Quality Inspection and Intelligent Discrimination Based on Solder Joint Virtual Evolving Technology;
基于焊点虚拟成形技术的SMT焊点质量检测和智能鉴别技术研究
17.
Fatigue-Life Predicyion for Lead-Free Solder Joints and Study for Effect of IMC on Reliability of Solder Joints;
无铅焊点寿命预测及IMC对可靠性影响的研究
18.
Solder Joint Fatigue Life Predicton with Submodel for a BGA Package;
子模型法预测BGA封装中焊点的热疲劳寿命