1.
Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology
基于多芯片组装技术的小型微波收发前端研制
2.
Construct cell immuno-chip with tissue microarray technique
应用组织芯片技术构建细胞免疫芯片
3.
Analysis of the Interconnect in Microwave Multi-chip Module by Parallel FDTD Technique;
并行FDTD技术分析微波多芯片组件的互连效应
4.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
5.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
6.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
7.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
8.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
9.
Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。
10.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
11.
Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor
采用芯片直接安装技术封装的风速风向传感器
12.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
13.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
14.
Research on Assembly System for Microfluidic Chips and Related Techniques;
面向微流控芯片的微装配系统及相关技术研究
15.
Research on Machine Vision Alignment Technology of Area Array Packaging;
面阵列芯片封装设备中的视觉定位技术
16.
Technology of Tissue Microarray and its Application and Development in Sports Biology;
组织芯片技术及其在体育生物中应用展望
17.
Applications Progress of Tissue Microarray Technology in Biomedical Research
组织芯片技术在生物医学研究应用中的新进展
18.
Application of tissue microarrays technology in the selection of molecular markers of tumors
组织芯片技术在肿瘤分子标志物研究中的应用