1.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
2.
Electron-induced Damage of CMOS with Shielded Packages
屏蔽材料封装CMOS器件的电子辐照损伤
3.
General specification for electronic components plastic packaging equipments
GB/T13947-1992电子元器件塑料封装设备通用技术条件
4.
Comparison of Cu and Au Ballbonding in Microelectronics Packaging
微电子器件封装中铜与金球键合的比较(英文)
5.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
6.
Integrated power electronics module based on chip scale packaged power devices
基于芯片尺寸封装功率器件的集成电力电子模块(英文)
7.
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料电子封装件中湿扩散有限元分析
8.
Package and Electrostatic Discharge Failure Analysis of Power Semiconductor Device Chip
功率器件芯片封装和静电放电失效分析
9.
Simulation of Mechanical Behavior of Plastic Electronic Package under Temperature and Humidity Environment;
温湿度条件下塑封电子器件力学行为的模拟
10.
This new material provides a main ehannal to solve the heat matching of electronic device package.
它的出现为解决电子元器件的封装热匹配问题提供了一条有效途径。
11.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
12.
electron gun vacuum lock
电子枪真空密封装置
13.
Optimal design of plastic electronic packaging component based on BP neural network
基于BP神经网络的模塑封电子器件优化设计
14.
The tully metallized optical fiber insert pin for metallized coupling package of optoelectronic devices is reported for the first time.
本文首次报导光电器件金属化耦合封装用全金属化光纤插针;
15.
Preparation and Performance of Encapsulation Material for Organic Light-emitting Device;
有机电致发光器件封装材料的制备及其性能研究
16.
The Performances Optimum of Organic Flourescent & Phosphorescent Devices and Study on the Encapsulation of OLEDs
有机电致荧光、磷光器件的性能优化与OLED封装技术的研究
17.
Encapsulation of organic light-emitting devices by parylene films
聚对二甲苯类薄膜用于有机电致发光器件的封装
18.
An E-mail from Li Ming
李明的一封电子邮件