1.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
2.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
3.
The Preparation and Research of the Al-Si-Cu-Sn-Zn Multi-Aluminum Solder
Al-Si-Cu-Sn-Zn多元铝基钎料的制备与研究
4.
Current situation on Sn-Zn lead-free solders affected with micro alloying elements
微量元素对Sn-Zn系钎料性能和组织的影响
5.
Effects of Alloying Elements on Performance of Sn-Zn Solder
合金化元素对Sn-Zn钎料性能的影响
6.
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究
7.
Investigation on Low Temperature Sn-Zn Base Lead-Free Solder Alloys
低熔点Sn-Zn系无铅钎料的研究
8.
Effects of oxidation on wettability of Sn-Zn alloys
氧化对Sn-Zn系无铅焊料润湿性的影响
9.
Rapid Growth of Pb-Sb-Sn and Pb-Sn-Zn Ternary Eutectics under Substantial Undercooling Conditions;
深过冷条件下Pb-Sb-Sn和Pb-Sn-Zn三元共晶的生长规律研究
10.
Effect of Alloying Element Zn, Sn, In on Microstructure and Properties of 925Ag;
合金元素Zn、Sn、In对925银组织和性能的影响
11.
The Research on Oxidation Resistance and Wettability of Sn-Zn System Lead-free Solder;
Sn-Zn系无铅钎料抗氧化性与润湿性研究
12.
Study of the Effect of CuP14 on Sn-Zn Solder Alloy System;
CuP14合金对Sn-Zn系钎料合金的性能影响研究
13.
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
14.
Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
15.
Effect of Sn on the Microstructure and Properties of Ti-Zr-Nb-Sn Alloy System;
Sn元素对Ti-Zr-Nb-Sn合金系组织和性能的影响
16.
Aging Characteristics of Pd-Ag-Sn-In-Zn Alloy
Pd-Ag-Sn-In-Zn合金时效特性
17.
Formation and Evolution of the Microstructures of the Sn-Ag-Zn Solders and the Interfaces with Cu Pad
Sn-Ag-Zn系无铅焊料及其连接界面组织形成与演化规律
18.
SN-type multivariate blending osculatory rational interpolation
SN型多元混合切触有理插值(英文)