1.
Simulation Study of the Sputtering Yield and the Target Erosion on the Magnetron Sputtering Process;
磁控溅射过程中溅射产额及靶材刻蚀的模拟计算研究
2.
Study on Etch Selectivity Ratio of Masking Materials in Silicon Deep Etching
硅深刻蚀中掩蔽层材料刻蚀选择比的研究
3.
Pulsed Laser Ablation and Target Optical Characteristic Investigation;
脉冲激光烧蚀及靶材光学性质的研究
4.
engraving machine, for photonic machining, for working with highly resistant materials
光子加工雕刻机,用于加工高耐蚀材料
5.
Device Processing: Etching. Surface passivation; dielectric films.
元件制程：蚀刻，表面钝化，介电材料薄膜。
6.
Surface Modification and Etching of Polymer by Excimer Laser Irradiation;
聚合物材料表面激光改性与刻蚀研究
7.
Micro Etching of GaN-Based Semiconductor Materials Using 157nm Laser
GaN基半导体材料的157nm激光微刻蚀
8.
Shallow Etching Rate and Roughness of Etched SiC Surfaces
SiC材料的低速率浅刻蚀工艺研究
9.
Measurements of Impulse Coupling Coefficient of Micro-laser Ablate Propulsion
激光微烧蚀靶材的冲量耦合系数测量方法
10.
Ablation of metal target materials by long-pulse high energy laser
长脉冲高能激光对金属靶材烧蚀实验研究
11.
More often, all of the materials exposed to the etchant have a finite etch rate.
通常，所有暴露在刻蚀剂中的材料都具有一定的刻蚀速率。
12.
Study on movement of charged particles and etched profile on target surface during magnetron sputtering
磁控溅射带电粒子的运动分布以及靶面刻蚀形貌的研究
13.
etchings, woodcuts, lithographs;
蚀刻、木刻、平版画；
14.
Challenges on Oxide Etch with 193nm Photoresist;
193nm光阻对于绝缘体材料刻蚀工艺的挑战
15.
The Basic Study on the Pulsed Laser Ablating Metals;
金属材料脉冲激光刻蚀微加工的基础研究
16.
Study of the Laser-chemical Combined Etching for Hard-to-machine Material;
难加工材料激光与化学复合刻蚀加工的研究
17.
Tritium Distributing in Stainless Steel Determined by Chemical Etching
化学蚀刻法测定氚在不锈钢材料中的分布
18.
The Etching of Single Crystal 6H-SiC in Inductively Coupled SF_6/O_2 Plasma
6H-SiC体材料在SF_6/O_2混合气体中的ICP刻蚀