1.
Analysis on Hydrodynamics and Material Removal Rate of Circular Translational CMP;
圆平动化学机械抛光的流体动力性能及材料去除率研究
2.
Basic Research on Hybrid Technology of Ultrasonic Elliptic Vibration Assisted Chemical-Mechanical Polishing a Silicon Wafer;
超声椭圆振动—化学机械复合抛光硅片技术的基础研究
3.
Study on Conditioner for Polishing Pad in CMP;
化学机械抛光用抛光垫修整器的研究
4.
Study on Electrochemical Mechanism and Polishing Rate of Chemical-Mechanical Polishing of Copper;
铜化学-机械抛光电化学机理与抛光速率的研究
5.
Study on Dynamic Pressure and Temperature of Slurry in Chemical-Mechanical Polishing of Silicon Wafer
硅片化学机械抛光加工区域中抛光液动压和温度研究
6.
A Finite Element Model for Wafer Materiall Removal Rate and Non-uniformity in Chemical Mechanical Polishing Process;
机械化学抛光中晶圆材料切削率和非均匀性有限元模型(英文)
7.
Study on Flows and Temperature Distribution of CMP Process;
化学机械抛光的流动性能和温度场的计算
8.
Study on Conditioning Technology of Polishing Pad in CMP;
化学机械抛光中抛光垫修整技术的研究
9.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
10.
Study on CMP Slurry of CVD Diamond Film;
CVD金刚石膜化学机械抛光液的研制
11.
A Test Study On Electrochemical Mechanical Finishing D60 Tungsten Steel
D60钨钢电化学机械复合抛光试验研究
12.
Electroplate and chemical mechanical polishing technology of ULSI
VLSI的电镀和化学机械抛光技术
13.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
14.
ECMP of Cu in the Preparation Process of ULSI
ULSI制造中Cu的电化学机械抛光
15.
Study on Electrochemistry and Polishing Rate of Chemical Mechanical Polishing of Semiconductor Silicon Wafer;
半导体硅片化学机械抛光电化学与抛光速率研究
16.
Influence of abrasive and chemical composition on chemo-mechanical polishing of MgO single crystal substrate
抛光液中磨料和化学成分对单晶MgO基片化学机械抛光的影响
17.
Research on Chemical-Mechanical Polishing Yield Driven Routing Algorithm
面向化学机械抛光的成品率驱动的布线算法研究
18.
Effection of Surface Roughness on Fluid Performance in the Chemical Mechanical Polishing Process
表面粗糙度对化学机械抛光工艺过程流动性能的影响