1.
Is the average and range of Solder Paste height measurements SPC controlled?
锡膏厚度测量的平均值和间距SPC是否受控?
2.
Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?
对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?
3.
Is the upper and lower specification limits for individual Solder Paste height measurements also defined?
单点锡膏厚度测量是否定义了其控制上限和下限?
4.
tin leaf of a thickness not exceeding 0.2mm
锡片,厚度未超过0.2mm
5.
The most obvious is the necessity for increased reflow temperature.
最明显的是，使用无铅锡膏必须提高回流焊温度。
6.
To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
7.
Research on structural optimization of the frame of high-accuracy solder paste printer
高精度锡膏印刷设备的机架结构优化研究
8.
best charcoal tin plate
最优厚锡层镀锡薄钢板
9.
The Thickness-Control of Gypsum-Fibre Board Base on Intelligent Control;
智能控制在石膏纤维板厚度控制中的应用
10.
Study on the Relative Problems of Controlling Thickness in Gypsum Fibre Board Product Line;
石膏纤维板生产线厚度控制相关问题研究
11.
Research into Impacts of Chip Solder-Plating Coat Thickness on Engineering Capability
芯片焊锡镀层厚度对工程能力影响研究
12.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
13.
Based on this, coating thickness structure of tinplate was put forward and the concept of coating apparent thickness was defined.
在此基础上，建立了镀锡钢板镀层厚度结构模型，定义了镀层的表观厚度。
14.
Effect of Plating Parameters on Plating Rate and Thickness as well as Surface Morphology of Electroless Tin Coating
化学镀锡工艺参数对沉积速率、镀层厚度及表面形貌的影响
15.
X-ray tin coating thickness gauge
x射线锡涂层测厚仪
16.
It will cause the paste oxidation and lose flux ratio balance if it is exposed for long-time.
锡膏与空气长时间接触后，会造成锡膏氧化、助焊剂比例成分失调。
17.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
18.
Research on precise alignment for full automatic solder paste printer
全自动视觉锡膏印刷机精密对准研究