1.
The Challenge Faced by the IC Packaging and Testing Industry under the International Financial Crisis
国际金融危机下封装测试行业面临的挑战
2.
The Researching of Algorithm for Bay-Layout in Semiconductor’s Assembly and Test Department
半导体封装测试车间隔间布局算法研究
3.
The Company's primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
4.
Study on Capacity Improvement of Semiconductor Assembly and Test Factory;
半导体集成电路封装测试工厂生产能力提升研究
5.
Cost Management Mode and Its Application in IC Assembly and Test Enterprises;
集成电路封装测试企业成本管理模式及应用研究
6.
Seal and Anchor Performance Test Installment Research of Packer
封隔器的密封与锚定性能测试装置研究
7.
Test of FBG Measured Concrete Strain Based on GFRP Packing
基于GFRP封装的FBG量测混凝土应变试验
8.
Assembly and testing are offered through a network of established partners.
封装及测试服务由我们的合作伙伴协作完成。
9.
Development of Automatic Test Experiment Set for Head Margin Stress
封头边缘应力自动测试实验装置的研制
10.
Wrapper Design Based on Partial Overlapping Test Slices
基于部分重叠片段的并行测试封装设计
11.
Design,package and test of ultra high-speed low power 4:1 multiplexer
超高速低功耗4:1复接器设计、封装及测试
12.
closed temperature measuring device
封闭式温度测量装置
13.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
14.
The method of measuring the lead-to-lead and loading capacitance of package leads
GB/T16526-1996封装引线间电容和引线负载电容测试方法
15.
Implement IPQC and OQC on the assembly and test vendor.
按公司产品要求抽检封装及测试厂生产及发货质量。
16.
After completely processed wafers are tested, those chips that pass the tests are ready to be packaged.
全部工艺完成后，片子要进行测试，合格的片子便去封装。
17.
Intel, for example, is investing m in a testing and packaging plant.
例如，英特尔正投资3.75亿美元，建立一个测试和封装工厂。
18.
Fabrication and Properties of Aluminum Oxide Filled Epoxy Encapsulates for Pulse Power Supplier;
脉冲电源用氧化铝/环氧树脂封装材料的制备关键技术与性能测试