1.
Underfill Delamination of Flip Chip on Low-Cost Board
低成本基板倒装焊底充胶分层裂缝扩展研究
2.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
3.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
4.
Electromigration in Sn3.0Ag0.5Cu flip chip solder joint
Sn3.0Ag0.5Cu倒装焊点中的电迁移
5.
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究
6.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
7.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
8.
Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint;
倒装焊焊点中金属元素迁移及组织演变
9.
Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability
倒装焊器件尺寸参数对低k层及焊点的影响
10.
Application of Machine Vision System in Flip-Chip-Bonding Equipment
机器视觉系统在倒装焊设备中的应用
11.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
12.
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
13.
Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling
固化残余应力对倒装焊底充胶可靠性的影响
14.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
15.
Application of Vision System and The Study of Contraposition Arithmetic of Flip Chip Bonding Machine
倒装焊机中视觉系统的应用及对位算法研究
16.
Affect and analysis of oxidation layer for the quality of flip chip bonding
氧化层对于倒装焊接质量的影响和分析
17.
Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint
无铅倒装焊点的热应力与湿热应力分析
18.
Simulation and Optimization of Bi-Slotsteel Welding Beam with the Clapboard Based on Finite Element Analysis
基于有限元带隔板双槽钢焊接梁焊接仿真优化