1.
Research on Alignment Methods and Optical Systems for Automatic Flip Chip Bonders
自动倒装贴片机对准方法研究及光路设计
2.
Design and Simulation of Pre-bonding System of Flip Chip Equipment for RFID Packaging;
RFID倒装键合机预贴片系统设计与仿真
3.
Component Placement Process Optimization for Dual-Gantry Placement Machine Based on Hybrid Genetic Algorithm
基于遗传算法的复合式贴片机贴装过程优化
4.
Design of a Vacuum Adsorption Dumping Gear for Flip Chip
真空吸附式倒装芯片翻转机械手设计
5.
Study on Inspection of SMT Chip Pins Based on Machine Vision;
基于机器视觉的表面贴装芯片引脚检测的研究
6.
Optimization on component allocation between placement machines in surface mount technology assembly line
表面组装技术生产线贴片机负荷均衡优化
7.
Research on Chip Detection and Location Technology Based on Machine Vision
基于机器视觉的表面贴装晶片检测与定位技术研究
8.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
9.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
10.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
11.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
12.
Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。
13.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
14.
Thermal Design of Integrated Power Electronics Module Using Flip-Chip Technology
倒装芯片集成电力电子模块的热设计
15.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景
16.
Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究
17.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
18.
Research on Machine Vision Inspection for SMT Assembly Products Defects;
贴片产品缺陷机器视觉检测方法研究