1.
Study on Mechanical Properties and Size Effects of Lead-Free BGA Solder Joint by Nanoindentation;
基于纳米压痕法的无铅BGA焊点力学性能及其尺寸效应研究
2.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
3.
Effect of BGA Solder Joint Void on Signal Transmission Performance
BGA焊点空洞对信号传输性能的影响
4.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
5.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
6.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析
7.
Thermal reliability optimization study on PBGA lead-free solder joint
PBGA无铅焊点热可靠性优化研究
8.
Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;
无铅回流焊冷却速率对焊点质量的影响
9.
SnAgCuBi-Solder Alloy Development and Its Joint Interfacial Behavior Study;
SnAgCuBi系无铅焊料的开发及其焊点界面行为的研究
10.
Solder Joint Fatigue Life Predicton with Submodel for a BGA Package;
子模型法预测BGA封装中焊点的热疲劳寿命
11.
Analysis on Mechanical Behavior of BGA Solder Joints under Shock Loading;
冲击载荷下BGA封装焊点的力学特性研究
12.
A Improvement Method On Segmentation And Extraction of BGA Joint by Mathematical Morphology
基于数学形态学BGA焊点分割和提取的改进方法
13.
Failure analysis of lead-free solder joints based on resistance strain critical point
基于电阻应变临界点的无铅焊点失效分析
14.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性
15.
Fatigue-Life Predicyion for Lead-Free Solder Joints and Study for Effect of IMC on Reliability of Solder Joints;
无铅焊点寿命预测及IMC对可靠性影响的研究
16.
Board Level Lead-Free Solder Joints Reliability Analysis under Drop Shock Loading;
板级无铅焊点跌落冲击载荷下可靠性分析
17.
Peel Stress Analysis of Lead-free Solder Ball Based on Numerical Simulation;
基于数值模拟的无铅焊点剥离应力分析
18.
Finite Element Simulation and Life Prediction for Reliability of Lead-free Solder in PBGA;
PBGA无铅焊点可靠性的有限元模拟与寿命预测