1.
Atmospheric Pressure RF-Plasma System and Its Application in Photoresist Stripping;
常压射频冷等离子体系统及其在光刻胶去除技术中的应用
2.
In microelectronics, the process of removing material, on a chip, left exposed by the exposure and development of the photoresist.
在微电子技术中,通过曝光并显影光刻胶除去芯片上的物质露出剩余部分的工艺。
3.
Fundamentals and Lithographie Technology Based on Pulse Laser Exposing SU-8 Photoresist;
脉冲激光曝光SU-8胶的基础与光刻技术研究
4.
Study on material removal theoretical model of zone polishing technology
环带抛光技术材料去除理论模型研究
5.
Extraction Technology of Quenching Agent in Mineral Luminescent Materials and Spectral Property;
矿物发光原料中猝灭剂的去除技术与光谱特性
6.
scaled down lithography
按比例缩小光刻技术
7.
The Research on Nano-TiO_2 Photocatalytic Removal of Nitrogen Oxides;
纳米TiO_2光催化技术对氮氧化物去除的实验研究
8.
The Study on Photocatalytic Technology for Surfactant Removal in Water;
光催化氧化技术去除水中表面活性剂的研究
9.
Decomposition of Styrene Gas with Outer Combined Plasma Photolysis(OCPP) Technology
外置式联合等离子体光解技术去除苯乙烯气体
10.
Study on the Improvement of Ashing Rate of Photoresist Ashing Process with CF4 Gas;
含氟气体的去光刻胶工艺灰化率提高的研究
11.
Study on Key Technologies in UV-LED Fiber Lithography System
紫外LED光纤光刻系统关键技术研究
12.
Removal of Humic Acid in Water with the Combination of TiO_2 Photocatalytic Oxidation and Microfiltration
TiO_2光催化和微滤结合技术对水中腐殖酸去除的研究
13.
Improvement of Photo Resist Remove for the 11μm DRAM Deep Trench Capacitor Process
0.11μm DRAM技术中深沟壑底部光阻残余物去除工艺的改善研究
14.
Study on Laser Interferometric Lithography Technology Based on Multi-beam Interference;
基于多光束相干的激光干涉光刻技术研究
15.
In photography, the light sensitivity of film emulsion.
在摄影技术中,胶片感光乳剂的光敏度。
16.
Investigation on Extreme Ultraviolet Lithography;
极紫外投影光刻中若干关键技术研究
17.
Research on Electron Beam Nanolithogrpahy Based on AFM;
基于AFM的电子束纳米级光刻技术研究
18.
Lithography Study of UV-LIGA Technology;
UV-LIGA技术光刻工艺的研究