1.
The Design and Development of LF-loader of LED Die-bonder;
LED键合机上料机构的设计与开发
2.
Design and Development of High-speed and High-precision LED Die Bonder;
高速高精度LED键合机焊头的设计与开发
3.
Design and Research of LED Die Bonder Feeder Mechanism Based on Virtual Prototyping Technology;
基于虚拟样机技术LED键合机传送机构的设计与研究
4.
Research on Key Technology of Automotive Rear Combination Lamp Based on LED;
基于LED的汽车后组合灯关键技术研究
5.
Effect of Bonding Materials on Parameters of 1 W White-LED
键合材料对1W白光LED性能的影响
6.
Solution for the Interface Between Keypad & LED and MSP430F14X Series
MSP430F14X系列单片机中键盘和LED显示接口的实现
7.
Impact of the chip bonding layer material on the thermal resistance of power LED
芯片键合层材料对功率型LED热阻的影响
8.
Combined Instrument System Adopting LED for Construction Machines
采用LED的工程机械组合仪表系统
9.
With the headset off, hold the Multifunction Button until the LED remains on (about 3 seconds).
当耳机在关机状态下，按住多功能键三秒钟左右，直至LED显示灯恒亮。
10.
Study on Key Techniques of White Light LED Communication Reception System
白光LED通信接收系统关键技术研究
11.
Study on Key Technologies in UV-LED Fiber Lithography System
紫外LED光纤光刻系统关键技术研究
12.
Key Factors of Thermal Resistance Test for High-Power LED
大功率LED稳态热阻测试的关键因素
13.
Analysis of Key Technologies in PERL Si-based LED
PERL Si基LED的几种关键技术分析
14.
glucosidic linkage
糖苷键[合],苷键[合]
15.
Key Technology Research on UV Curing Source with LED Array;
LED阵列型紫外固化光源的关键技术研究
16.
Study on Key Techniques of Visible Light Wireless Communication Based on LED;
基于LED的可见光无线通信关键技术研究
17.
Research on Some Key Technologies for Real-Time Visual Tracking Using Infrared LED Markers;
红外LED实时视觉跟踪的若干关键技术研究
18.
Key Points of Improving the LED Technology in Terms of the Indoor Illumination Developing Trend
从室内照明发展趋势论LED技术提升的关键