1.
epoxy seal transistor
环氧树脂封装晶体管
2.
Fabrication and Properties of Aluminum Oxide Filled Epoxy Encapsulates for Pulse Power Supplier;
脉冲电源用氧化铝/环氧树脂封装材料的制备关键技术与性能测试
3.
epoxy enclosed transistor
环氧树脂密封晶体管
4.
Study on the Embedment Encapsulation Technique of Epoxy Resin Mixed with Metal Powder of Fiber Bragg Grating
环氧树脂掺金属粉末嵌入式FBG封装技术研究
5.
DEVELOPMENT OF EPOXY/EPOXY-SILSESQUIOXANE HYBRID MATERIAL FOR LED PACKAGING
LED封装用环氧树脂/环氧倍半硅氧烷杂化材料的研制
6.
The Preparation and Property Research of Epoxy Resin Based Electric Electronic Packaging Material;
环氧树脂电力、电子封装材料的制备及其性能研究
7.
Study on Ultraviolet Resistance of Modified Epoxy Resin with Nano ZnO;
纳米ZnO改性LED封装用环氧树脂的抗紫外老化研究
8.
Study on Synthesis and Performances and of Epoxy Resin Materaials Used in Elexctronic Packaging
电子封装材料用新型环氧树脂的制备及性能研究
9.
Flowability Analysis of the Epoxy Molding Composite used for the Packaging of Large-Scale Integrated Circuit
大规模集成电路封装用环氧树脂复合材料流动性影响分析
10.
Polyester film,inductive， epoxy resin coating.
聚乙酯膜，有感结构，环氧树脂包封。
11.
Preparation and Properties Study on Encapsulating Materials of Epoxy Resin;
环氧树脂灌封材料的制备与性能研究
12.
Structure: Adopting to polyester film as dielectric, iuductrive construction, epoxy resin as dip material.
结构:聚酯膜作介质,有感结构,环氧树脂包封。
13.
Research on the Application of Epoxy Resin Concret to Paving on Steel Bridge Deck;
环氧树脂混凝土在钢桥面铺装中的应用研究
14.
The preparation and properties of superfine glass powder/epoxy resin composites were studied.
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
15.
Study on Thermal Expansion Behavior of EP/PU/DDM System Cured by Microwave
微波固化环氧树脂/苯酚封端的聚氨酯预聚体系的热膨胀行为研究
16.
Nitto Denko Semiconductor Related Epoxy Molding Compound Strategic Analysis of China Market;
日东电工半导体用环氧树脂塑封料中国市场策略研究
17.
Studies on the Sealant Using Expoxy Modified Arylic Resin and Nano-SiO_2 Composite Material;
密封胶用环氧改性丙烯酸树脂及纳米复合材料的工艺研究
18.
Properties of Polyurethane-Modified Epoxy Resin Encapsulating Materials Filled with Glass Fiber
玻璃纤维填充聚氨酯改性环氧树脂灌封材料的性能