1.
Multiplayer bonding technique for high power diode laser
高功率二极管激光器封装的多层焊接技术
2.
Design and Thermal Characteristics Analysis of Uncooled 980 nm Semiconductor Laser Packaging
非制冷980nm半导体激光器封装设计与热特性分析
3.
Research on DFB Laser Coaxial Packaging Laser Welding Technology for CATV
用于CATV的DFB激光器同轴封装激光焊接技术研究
4.
Study on the Key Techniques of Fiber Active Devices Packaging with Laser Welding;
光纤有源器件激光焊接封装的关键技术研究
5.
Research of Demodulation and Packaging Tecknics on Fiber Grating Sensors;
光纤光栅传感器解调技术及封装工艺的研究
6.
The Fiber Bragg Grating and the Sensing Study on the Sensor Encapsulated by the Alloyed Steel;
光纤Bragg光栅及其合金钢封装传感器特性研究
7.
Fiber Bragg Grating Temperature Sensor without the External Stress Encapsulation
无外应力封装的光纤Bragg光栅温度传感器
8.
Packaging technique of enhancing temperature-sensitivity for fiber bragg grating sensor
光纤布拉格光栅(FBG)温度传感器增敏封装技术
9.
Study on pressure sensing technology of a compensable fiber grating
光纤光栅高压传感器封装技术实验研究
10.
Study on the Dissipation and Packaging of High Power Laser Diode Module;
大功率半导体激光模块的散热与封装研究
11.
Research on Reliability of Au80Sn20 Solder Joint for Laser Diode Packages;
在激光二极管LD封装中Au80Sn20焊点的可靠性研究
12.
Front Oil Seal Installer 6635
前油封安装器6635
13.
Measurement and analysis of the characteristics of transverse modes of a sealed-off He-N_2-CO_2 laser
封离式He-N_2-CO_2激光器横模特性的测量与分析
14.
Pressure adjustment of hermetically sealed relay spring by laser-forming
密封继电器弹簧片压力的激光校正研究
15.
PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY
基于体硅微机械工艺的光波导器件封装技术
16.
Research and Design of SFP Optical Transceiver Circuit;
小型封装SFP光纤收发器电路研究与设计
17.
Improvement on the Packaging Process of 1X2 Single Mode FBT Fiber Splitters
1X2单模融拉型光纤分路器封装工艺的改进
18.
And they have a security system like with laser beams.
而且他们有类似于激光器的安全装置