1.
Study on the Microelectronic Solder Balls Preparation Method;
微电子BGA 焊球制备方法的研究
2.
Influence of Spheroidization Temperature on Quality of BGA Solder Ball
球化温度对BGA钎焊球质量的影响
3.
Influence of Spheroidization Temperature on Real Sphericity and Surface Quality of BGA Solder Ball
球化温度对BGA钎焊球真球度及表面质量的影响
4.
BGA Assembly Technology Research for Solder Ball's Reliability
对BGA封装技术中锡球焊接可靠性的研究
5.
Application of ESPI in Solder Ball Failure Test on Board-Level BGA Package
ESPI在板级BGA封装器件焊球失效检测中的应用
6.
Effect of BGA Solder Joint Void on Signal Transmission Performance
BGA焊点空洞对信号传输性能的影响
7.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
8.
Defects Inspection and MATLAB Simulation of Chips BGA Packages Based on Machine Vision
基于机器视觉的芯片BGA封装焊球缺陷检测及MATLAB仿真
9.
Solder Joint Fatigue Life Predicton with Submodel for a BGA Package;
子模型法预测BGA封装中焊点的热疲劳寿命
10.
Analysis on Mechanical Behavior of BGA Solder Joints under Shock Loading;
冲击载荷下BGA封装焊点的力学特性研究
11.
A Improvement Method On Segmentation And Extraction of BGA Joint by Mathematical Morphology
基于数学形态学BGA焊点分割和提取的改进方法
12.
The Research and Development of Laser-Soldering System Based on BGA Chips;
基于BGA芯片的激光植球系统的设计与研究
13.
Study on Mechanical Properties and Size Effects of Lead-Free BGA Solder Joint by Nanoindentation;
基于纳米压痕法的无铅BGA焊点力学性能及其尺寸效应研究
14.
FEM Simulation Research on Thermal Reliability of BGA Solder Joints under Material Choice;
材料选择对BGA焊点热可靠性影响的有限元仿真研究
15.
BGA Solder Joint Defects Image Processing Method Based on 2D Imaging by Radiographic Real Time Testing
基于2D投影的BGA焊点X射线检测缺陷图像处理方法
16.
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
17.
Study on Machine Vision Inspection and Automatic Orientation Control Technology of Full-Automatic BGA Ball Mounting;
BGA全自动植球机视觉检测和自动对准控制技术研究
18.
Vacuum Pen device is used to lift up and place BGA from/ on mainboard to meet BGA non-touch nature.
真空吸放笔装置,实现零作用力吸放功能,符合BGA免触的特性,无损拆焊的组件。