1.
Preparation and Size Classification of Alumina Series Abrasive Particles for Chemical Mechanical Polishing;
氧化铝系化学机械抛光磨料的制备及颗粒分级
2.
Influence of abrasive and chemical composition on chemo-mechanical polishing of MgO single crystal substrate
抛光液中磨料和化学成分对单晶MgO基片化学机械抛光的影响
3.
Preparation of Ti or Zr-doped Ceria Abrasives and Their Chemical Mechanical Polishing Performance
钛锆掺杂CeO_2磨料的制备及其化学机械抛光性能
4.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
5.
Characteristic of Material Removal in Chemical Mechanical Polishing of Silicon Wafer Based on Abrasion Behavior
基于磨损行为的单晶硅片化学机械抛光材料的去除特性
6.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
7.
Study on Chemical Mechanical Polishing of Tantalum Lithium Crystal Wafer;
光电子材料钽酸锂晶片化学机械抛光过程研究
8.
Study on Conditioner for Polishing Pad in CMP;
化学机械抛光用抛光垫修整器的研究
9.
Study on Material Removal Mechanism for Non-contact CMP;
非接触化学机械抛光的材料去除机理研究
10.
Study on Electrochemical Mechanism and Polishing Rate of Chemical-Mechanical Polishing of Copper;
铜化学-机械抛光电化学机理与抛光速率的研究
11.
The most common finishing operations are mechanical, such as milling, grinding, or polishing with abrasives.
最普通的精加工工序是用机械的方法，如研磨，磨削或用磨料抛光。
12.
Study on the Technologic Parameter and Wear Model of Retaining Ring in Chemical Mechanical Polishing Process;
化学机械抛光保持环工艺参数及磨损模型的研究
13.
Study on Conditioning Technology of Polishing Pad in CMP;
化学机械抛光中抛光垫修整技术的研究
14.
Experimental and Theoretical Study on the Material Removal in the Chemical Mechanical Polishing at Molecular Scale;
基于分子量级的化学机械抛光材料去除机理的理论和试验研究
15.
Study on the Material Adhesion Removal Mechanism in Chemical Mechanical Polishing of Silicon Wafers
芯片化学机械抛光过程中材料吸附去除机理的研究
16.
Newer materials, such as Syton, are chemo-mechanical and are beginning to be used.
较新的材料，如Syton这种化学?机械抛光剂正开始使用。
17.
Analysis on Hydrodynamics and Material Removal Rate of Circular Translational CMP;
圆平动化学机械抛光的流体动力性能及材料去除率研究
18.
Study on Chemical Mechanical Polishing of Semiconductor Silicon Wafer with Nano-SiO_2 Slurries and Its Application;
纳米SiO_2浆料中半导体硅片的化学机械抛光及其应用研究