1.
Device level vacuum packaging technologies of MEMS gyroscopes
MEMS陀螺仪器件级真空封装技术
2.
electron gun vacuum lock
电子枪真空密封装置
3.
General technical specification of vacuum packaging machine and vacuum-gas flushing packaging machine
GB/T9177-1988真空真空充气包装机通用技术条件
4.
Analysis on Internal Sealing Technologies of Hydrate Pressure Temperature Core Samplers
天然气水合物保真取心装置内部密封技术分析
5.
Electrical Simulation Research for IC Package Via
集成电路封装基板过孔电学仿真技术研究
6.
Research on Film Vacuum Resin Dosing Technology Applying in Solar Battery;
太阳能电池真空树脂薄膜灌封技术的研究
7.
Simulation research on ANC in enclosed sound space
封闭空间声场的有源消声技术仿真研究
8.
Vacuum technology--Pipeline fittings--Mounting dimensions
GB/T16709-1996真空技术管路配件装配尺寸
9.
Study on the Principle and Application of Microwave Vacuum Packing Techniques
微波真空包装技术的原理及应用研究
10.
Research on Vacuum Resin Dosing Technology Applying in Electronic Body and Special Material of Air-To-Air Missile;
空空导弹电子本体特种料真空树脂灌封关键技术的研究
11.
Vacuumizing is often used in the rice packaging as a fresh technique.
真空包装是大米销售包装常用的一种保鲜技术。
12.
Application of Vacuum Pump Technology by Using Liquid-ring Vacuum Pump in Large-scale CDU
机械抽真空技术在大型常减压蒸馏装置的应用
13.
The Research of Vaccumizing Technique for Rice Combining with Circulation Surrounding;
结合流通环境对大米真空包装技术的研究
14.
Research on Vacuum Hot Contract Packaging (VHCP)Technologies for Chilled Beef;
冷却牛肉真空热缩包装保鲜技术的研究
15.
Construction Technology of Evacuated Tubular Solar Water Heating System with On-site Assembly
现场组装真空管式太阳能热水系统施工技术
16.
Microsystem Technology (Serials Four)──Packaging Technologies
微系统技术（连载四）──封装技术
17.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
18.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段