1.
Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling
固化残余应力对倒装焊底充胶可靠性的影响
2.
Underfill Delamination of Flip Chip on Low-Cost Board
低成本基板倒装焊底充胶分层裂缝扩展研究
3.
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
4.
The Processes Parameter Controlling of Non-flow Battom Soldering Paste of the FCB Compositon
倒装芯片结构中不流动底部填充工艺参数
5.
Electromigration in Sn3.0Ag0.5Cu flip chip solder joint
Sn3.0Ag0.5Cu倒装焊点中的电迁移
6.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
7.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
8.
bottom loading belt
底带装载式胶带输送机
9.
Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint;
倒装焊焊点中金属元素迁移及组织演变
10.
Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability
倒装焊器件尺寸参数对低k层及焊点的影响
11.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
12.
Enclosure Gel filled, ultrasonically welded, high density ABS housing.
附胶体填充，超声焊接，高密度abs外壳。
13.
Application of Machine Vision System in Flip-Chip-Bonding Equipment
机器视觉系统在倒装焊设备中的应用
14.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
15.
Non-refillable steel welded cylinder for industry cylinder
GB17268-1998工业用非重复充装焊接钢瓶
16.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
17.
Application of Vision System and The Study of Contraposition Arithmetic of Flip Chip Bonding Machine
倒装焊机中视觉系统的应用及对位算法研究
18.
Affect and analysis of oxidation layer for the quality of flip chip bonding
氧化层对于倒装焊接质量的影响和分析