1.
Design and Study on Properties in Sn-Based High Multicomponent Temperature Lead-Free Solders
Sn基多组元高温无铅焊接材料的设计及性能研究
2.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
3.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
4.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
5.
High precision welding materials pure tin lead alloy products.
高级精密焊接纯锡铅合金材料制品。
6.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
7.
Corrosion Research of Different Lead Free Wave Solder Pot Materials;
无铅波峰焊不同锡炉材料溶蚀行为研究
8.
DETERMINATION OF ANAND PARAMETES FOR Pb-FREE MATERIAL SnAgCu AND LIFE PREDICTION FOR A CSP STRUCTURE
无铅材料SnAgCu的Anand参数测定和CSP焊点寿命预测
9.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
10.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
11.
Formation and Evolution of the Microstructures of the Sn-Ag-Zn Solders and the Interfaces with Cu Pad
Sn-Ag-Zn系无铅焊料及其连接界面组织形成与演化规律
12.
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
13.
Study on Combustion Velocity and Temperature of Non-electric Welding Material
无电焊接材料的燃烧速度和燃烧温度研究
14.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
15.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
16.
Application and Development of Surface Mount Technology;
从有铅向无铅焊接过渡阶段应注意的问题
17.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
18.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究