1.
A series of disperse dyestuff contained microcapsule is prepared with core/ shear ratio1∶3 and different diameters and distributions via in-situ polymerization.
采用原位聚合法制备芯壁比1∶、同粒径及分布的系列分散染料微胶囊。
2.
Various influent factors to extended release property were studied through spectrophotometry.
研究了芯壁比、燥温度、燥时间和环境释放温度对微胶囊缓释性能的影响。
3.
Performance of the Arc Spraying Coatings with Core Wires Used on the CFB Boiler's Water-cooled Wall;
流化床锅炉水冷壁粉芯丝材电弧喷涂涂层性能
4.
Study on the Design and Kinematic Simulation of the Rotary Sidewall Coring Tool;
旋转式井壁取芯器的设计与机构运动仿真研究
5.
Principle and Devisal of QXF36 Model Controller to the Wall of Well on the Ground;
QXF36型井壁取芯器地面控制仪的原理与设计
6.
BDF HIGH STRENGTH THIN-WALL BOX OR TUBE FILLER CAST-IN-SITU HOLLOW CONCRETE FLOOR SYSTEM
BDF高强薄壁箱体、筒芯现浇混凝土空心楼盖技术
7.
A new kind of craftwork flow used for all-position flux-cored arc welding self
一种新型厚壁全位置药芯焊丝自保护焊
8.
Comparison between Service Trade Barrier and Goods Trade Barrier;
服务贸易壁垒与货物贸易壁垒的比较
9.
Performance Comparison of Permalloy Core and Coreless Solenoidal Microinductors
铁芯和空芯螺线管型微电感器的性能比较
10.
THE COMPARISON BETWEEN SMALL-HOLE ROPE CORING AND COMMON CORING
小口径绳索取芯法与普通钻进取芯法比较
11.
Numerical Study on Composite Sandwich Thin-walled Bar with Closed Section
封闭截面复合材料夹芯薄壁杆件的数值方法研究
12.
Pilu Temple Mural Painting and Della Segnatura Mural Painting Comparison
毗卢寺壁画与拉斐尔“签署厅”壁画之比较
13.
The Comparision of Protein from Pollen Wall between Citrus Grandis Var.Shatinyu Hort. and Citrus Grandis;
沙田柚花粉壁蛋白和酸柚花粉壁蛋白的比较
14.
Comparative Study of Graffiti Mural and Mainstream Public Mural
涂鸦壁画与主流公共壁画的比较与融合
15.
Specially design co-extruding die, merely need to replace core mandril, it may produce solid-wall pipe, solid wall inner helix pipe foamed pipe and foam inner helix pipe.
◆特殊设计的共挤模头，只需要换芯棒即可同时生产实壁管、壁内螺旋管、泡管、泡内螺旋管。
16.
The difficulty lies primarily in the fact that the fiber core is relatively small.
困难主要在于纤维芯比较
17.
PREPARATION OF ACTIVATED CARBON WITH HIGH SPECIFIC SURFACE AREA FROM CORN COB
玉米芯制备高比表面积活性炭的研究
18.
VLIW chips can cost less, burn less power and achieve significantly higher performance than comparable RISC and CISC chips.
与RISC和CISC芯片相比，VLIW芯片的成本低、功耗低、并能获得更高的性能。