1.
ELECTROLESS PLATING Cu ON Mo POWDER AND ITS REACTION MECHANISM
Mo粉表面化学镀Cu及其反应机理
2.
Electroless Plating of Cu-Ni-P Alloy Film for EMI Shielding on Epoxy Resin Surface;
环氧树脂表面化学镀Cu-Ni-P合金电磁屏蔽膜
3.
Research on Property of Electroless Ni-Cu-P and Composite Coating of Ni-Cu-P-Nanoparticles;
化学镀Ni-Cu-P合金及其纳米粒子复合镀研究
4.
Preparation of Cu-Si Composite Powders by Electroless Plating Method
化学镀法制备Cu-Si复合粉体工艺研究
5.
Research of Micro-Pattern Electroless Ni-P/Cu Plating Technology and Coating Structure;
微元图形化学镀Ni-P/Cu工艺与其镀层组织的研究
6.
Research on Wear Behavior of Ni-Cu-P Coacting in Different Mediums
化学镀Ni-Cu-P镀层在3种腐蚀介质中冲蚀行为的研究
7.
Local corrosion of electrodeposited multi-layers of AZ91D magnesium alloy and its processing of electroless plated Ni-P-Cu layers
AZ91D镁合金表面复合镀层局部腐蚀现象解析及化学镀Ni-P-Cu的研究
8.
Preparation of Cu-wrapped Al_2O_3 Nano Powders by Electroless Plating Method;
化学镀法制备Cu包覆纳米Al_2O_3粉体工艺的研究
9.
Study on Giant Magneto-impedance Effect in Electroless Plated CoNiP/Cu Composite Wires;
化学镀CoNiP/Cu复合结构丝巨磁阻抗效应研究
10.
Ni-Cu-P Electroless Deposition on the Surface of FBG
光纤布拉格光栅表面化学镀Ni-Cu-P合金
11.
Preparation and Sintering Behavior of Nano-Cu/Al_2O_3 Composite Powders by Electroless Copper Plating
化学镀法制备纳米Al_2O_3/Cu复合粉体及其烧结行为
12.
Preparation and Sintering Behavior of Cu-Al_2O_3 Nano-composite Powders by Electroless Copper Plating
化学镀法制备Cu/Al_2O_3复合粉体及其烧结行为
13.
Antibacterial Performance of Electroless Ni-Cu-P/Nano-TiO_2,Composite Coating on AZ91D Magnesium Alloy
AZ91D镁合金Ni-Cu-P/纳米TiO_2化学镀层的抗菌性能
14.
Research on depositing mechanism of electroless Ni-Cu-P plating on NdFeB permanent magnet materials
NdFeB磁性材料化学镀Ni-Cu-P合金沉积机理研究
15.
Preparation of Cu-B_4C Composite Powders by Electroless Plating and Sintering of Composite Ceramic
化学镀法制备Cu-B_4C复合粉体及其复相陶瓷的烧结
16.
Study on Amorphous Ni-Cu-P Alloy Chemical Plating for New Type of Ammunition Packaging Material
化学镀非晶态Ni-Cu-P合金镀层作为新型弹药包装材料的耐环境试验研究
17.
Plating Technology and Properties of Electroless Ni-Mo-P Alloy Coatings
化学镀Ni-Mo-P合金镀工艺及镀层性能
18.
The chemical symbol for copper is "Cu".
铜的化学符号是Cu。