1.
Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。
2.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
3.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
4.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
5.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
6.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
7.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
8.
Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging;
MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用
9.
Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor
采用芯片直接安装技术封装的风速风向传感器
10.
Research on Assembly System for Microfluidic Chips and Related Techniques;
面向微流控芯片的微装配系统及相关技术研究
11.
Research on Machine Vision Alignment Technology of Area Array Packaging;
面阵列芯片封装设备中的视觉定位技术
12.
Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology
基于多芯片组装技术的小型微波收发前端研制
13.
Design of a Vacuum Adsorption Dumping Gear for Flip Chip
真空吸附式倒装芯片翻转机械手设计
14.
Thermal Design of Integrated Power Electronics Module Using Flip-Chip Technology
倒装芯片集成电力电子模块的热设计
15.
Construct cell immuno-chip with tissue microarray technique
应用组织芯片技术构建细胞免疫芯片
16.
Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究
17.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
18.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景